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This roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer.

Just Ask Tara Dunn: Will IC Substrates Be Produced in Volume in the U.S.?

December 1, 2020 | I-Connect007 Editorial Team

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. Today's question: Do you think IC substrates (BGA, CSP, flip chip, etc.) will ever be produced in high volumes in the U.S.?





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COLUMNS:

Punching Out! Dealing With Burnout

November 24, 2020 | Tom Kastner, GP Ventures, Ltd.

Owners of companies in the PCB and PCBA industries are used to ups and downs, but yeesh, 2020 has been tough. The good news is most owners have survived all kinds of stressful situations in the past, and hopefully, better days are...

The Right Approach: Simplify Your QMS Documentation Through KISS, Part 1

November 24, 2020 | Steve Williams, The Right Approach Consulting

While documentation is often viewed as a necessary evil, it is a very important aspect of any quality system but needs to be functional. The documentation system needs to be lean, mean, and user-friendly to the workforce. Steve...

It’s Only Common Sense: Here We Go Again—Pandemic Shutdown, Round Two

November 23, 2020 | Dan Beaulieu, DB Management

For a number of reasons, the U.S. and other countries around the world are entering into the second round of shutdowns, which promises to be more severe than the last time. As we approach this new chapter of shutdowns, Dan Beaulieu...

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