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Dissecting the IPC Regional Survey on PCB Technology Trends

July 15, 2019 | I-Connect007 Editorial Team

Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.

An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards

July 12, 2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle Engineering

Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.





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It’s Only Common Sense: Five Tips for Rescuing Orphans

July 15, 2019 | Dan Beaulieu, DB Management

It has happened to all of us. It’s part of doing business. No matter how hard you try, somewhere along the way, you lose a customer. These lost customers are what my friend Bruce appropriately dubbed “the orphans.”...

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