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TRI Launches New High-Reliability 3D AOI Solution
January 11, 2021 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI), a leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce the release of the high-reliability TR77000QM SII 3D AOI.
The TR7700QM SII is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry and other high reliability industries.
As the miniaturization of components and PCB boards increases, the demand for resolution inspection increases; TRI inspection platforms have robust metrology capabilities that enable high accuracy and reliability inspection, lowering the false call rates. TRI’s 3D AOI technologies range from Depth from Focus (DFF), 3D Blue Laser, and Moiré projection for virtually Zero-escape Inspection.
Suggested Items
Advocacy: There’s No Time to Waste
05/21/2024 | Marcy LaRont, PCB007 MagazineIn the late 1990s, I worked for a PCB company ardently working to build manufacturing presences in Malaysia, Taiwan, and eventually China’s mainland. For some of us who had the resources, we followed our OEM customers offshore as they began demanding increasingly greater price concessions from their stateside suppliers. The government was not coming to the rescue of the PCB manufacturer, so we rode the changing economic tide as it turned unwaveringly toward globalism and cheaper labor.
Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC
05/21/2024 | Real Time with...IPC APEX EXPODevan Iyer, IPC's new chief strategist of advanced packaging, shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies across different markets. Devan is looking forward to collaborating with IPC and industry members as they find ways to connect emerging package technologies with PCB/EMS systems.
TPCA Releases Guide to Help PCB Industry Achieve Low-Carbon Transformation
05/21/2024 | TPCAThe introduction of EU carbon tariffs, international brands committing to carbon neutrality, and the upcoming carbon fee in Taiwan means that carbon reduction is no longer just a slogan. Domestic and international pressures have turned carbon reduction into the golden grail of corporate sustainability.
SEMICON Europa 2024 Call for Abstracts Opens
05/21/2024 | SEMISEMI Europe announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit and during presentations on the show floor.
American Standard Circuits/ASC Sunstone Circuits Showcase Cutting-edge Technology at PCB East 2024
05/21/2024 | American Standard CircuitsAmerican Standard Circuits (ASC) and ASC Sunstone Circuits are excited to announce their participation in PCB East 2024, a premier event for the printed circuit board and electronics design industry. The event will take place from June 4-6, 2024, at the Boxboro Regency Hotel and Conference Center in Boxborough, MA.