SIA Welcomes Progress Toward Selection of National Semiconductor Technology Center Leadership
June 21, 2023 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer welcoming the Commerce Department’s appointment of a committee that will select the board of trustees of the National Semiconductor Technology Center (NSTC), a critical entity established by the CHIPS and Science Act of 2022 to promote U.S. semiconductor research and development.
“Today’s announcement marks good progress toward standing up the National Semiconductor Technology Center, a centerpiece of the historic CHIPS and Science Act enacted last year to reinvigorate domestic chip production and innovation. The selection committee members’ deep and varied experience makes them well-positioned to appoint a strong board of trustees that will ensure effective and efficient NSTC implementation. We look forward to working with the NSTC selection committee, the eventual board of trustees, and Secretary Raimondo and other leaders in the Commerce Department to ensure the CHIPS and Science Act provides maximum return on investment for America’s economy, national security, and supply chain resilience.”
SIA and the Boston Consulting Group (BCG) last October released a report identifying five key areas of the semiconductor R&D ecosystem that should be strengthened by the CHIPS Act’s R&D funding. The report, titled “American Semiconductor Research: Leadership Through Innovation,” highlights the importance of government-industry collaboration on the NSTC and the National Advanced Packaging Manufacturing Program (NAPMP). The study also calls for CHIPS funding to be used to bridge key gaps in the current semiconductor R&D ecosystem to help pave the way for sustained U.S. chip innovation leadership.
The CHIPS Act’s manufacturing incentives have already sparked substantial investments in the U.S. In fact, companies in the semiconductor ecosystem have announced dozens of new projects across America—totaling more than $200 billion in private investments—since the CHIPS Act was introduced. These announced projects will create more than 40,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
The New Industry: Will the Growth Continue?
04/30/2024 | I-Connect007 Editorial TeamHow sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.
Real Time with… IPC APEX EXPO 2024: Tools, Training, and Trends in Manufacturing Engineering
04/25/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and Product Specialist Erik Bateham of Polar Instruments discuss Polar's latest technology, including their role in aiding manufacturing engineers. They highlight the advanced capabilities of Polar's tools and the critical role of signal integrity analysis, as well as the importance of accurate modeling in board manufacturing. Polar's unique training approach and demonstration contact details are also explored.
Determining the Value-add of Box Build
04/24/2024 | Nolan Johnson, I-Connect007At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.