BMW Group, Qualcomm Demonstrate Continued Momentum
September 6, 2023 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
BMW Group and Qualcomm Technologies, Inc. announced the companies’ have extended their technology collaboration beyond driver assistance and automated driving technologies, bringing the latest Snapdragon® Digital Chassis Solution advancements to power BMW Group’s new vehicles for safer, smarter and sophisticated experiences to drivers and passengers. Leveraging both companies’ expertise in innovation, BMW is working with Qualcomm Technologies as the automaker’s systems solutions provider, to utilize the latest generation of the Snapdragon® Cockpit Platform to power BMW Group’s new in-vehicle experiences, as well as the Snapdragon® Auto Connectivity Platforms for 5G connectivity to bring ultra-fast and seamless connectivity to vehicles with new BMW iDrive generation “QuickSelect” and new Operating Systems 8.5 and 9.
Taking the driver-vehicle relationship to the next level, new BMW vehicles and vehicles of MINI’s New Family, are designed to utilize next-generation Snapdragon Cockpit Platforms to power their operating systems, the automaker's outstanding interface for intelligent yet simple control, communications, and infotainment. Snapdragon Cockpit Platforms are not only engineered to deliver high-definition graphics to iDrive’s touch and voice-controlled display unit but to also deliver a fully immersive in-cabin experience, enabling premium audio and crystal-clear voice communications throughout the vehicle's cabin. Working with the Snapdragon Cockpit Platforms, iDrive is designed to bring a new level of digital intelligence for convenience and safety, helping to enhance the BMW Intelligent Personal Safety Assistant's capabilities with highly intuitive artificial intelligence (AI) features. These include in-car virtual assistance, natural language interactions between the vehicle and driver, in-cabin monitoring for contextual safety, and precise positioning for safer and smarter navigation.
The latest BMW vehicles also feature the Snapdragon® Auto 5G Modem-RF for ultra-fast connectivity, quick network response times, and the reliability needed to support both safety features and always-connected experiences inside and outside of vehicles.
As a part of the companies’ technology collaboration, BMW Group and Qualcomm Technologies are currently co-developing a comprehensive, open and scalable ADAS system ranging from New Car Assessment Program (NCAP), Level 2 Advanced Driving Assistance Systems to Level 3 High Automated Driving functionalities to expand the accessibility of safer self-driving technologies to the global automotive ecosystem. These will be based on the Snapdragon Ride™ Platform with an integrated Ride Vision software stack and the first L2+ systems are expected to be available beginning in 2025.
“BMW’s iDrive has long been the gold standard for in-car control and communications interfaces. For the latest BMW iDrive generation “QuickSelect,” the Snapdragon Digital Chassis is the ideal technology platform to enable enjoy intuitive, immersive, and connected full-cabin experiences for drivers and passengers,” said Stephan Durach, senior vice president, connected company development, technical operations, BMW Group. “The versatility of Snapdragon Digital Chassis has made it easy for our companies to expand our working relationship beyond ADAS/AD solutions to create more comprehensive digital offerings together.”
“Qualcomm Technologies is pleased with the momentum we’re seeing with our Snapdragon Digital Chassis providing state-of-the-art digital capabilities and features for drivers and passengers of BMW’s new vehicles,” said Nakul Duggal, senior vice president and general manager, automotive & cloud computing, Qualcomm Technologies, Inc. “Through the Snapdragon Digital Chassis solutions, we are empowering BMW, as well as the broader automotive ecosystem, to rapidly transform their vehicles for the digital era. We look forward to continuing our work with BMW Group to rapidly bring innovative and industrially competitive features to market.”
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