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USPAE to Springboard U.S. Technology Forward

04/30/2024 | Marcy LaRont, PCB007 Magazine
The U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.

Aaron Woolf, Dylan Peterson Join SIA Team

04/22/2024 | SIA
The Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

IMAPS & IPC to Host Onshoring Workshop

04/16/2024 | IPC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.

Team Spirit: IPC's Global Advocacy Team Acting on Your Behalf

04/15/2024 | Kate Koger, IPC
The once seemingly apolitical world of printed circuits and soldering irons has evolved into the politically engaged electronics manufacturing industry that we know today. This landscape of technology is quickly evolving by intersecting innovation, economics, and politics.

imec Inks MoU with the intention to Establish New 300mm R&D Process Line in Spain for Specialized Chip Technologies

03/20/2024 | Imec
The Spanish government, together with the regional government of Andalusia and imec, a world-leading research and innovation hub in nanoelectronics and digital technology, announced today that they have signed a Memorandum of Understanding (MoU) outlining their intent to establish a specialized chip technology pilot line in Malaga (Andalusia).
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