Sondrel Announces Two New Design Contract Wins
February 29, 2024 | SondrelEstimated reading time: 1 minute
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip. In addition, Sondrel has received new purchase orders for Design Consultancy Services from two existing customers operating in the Network processor and Edge AI Processor sectors. These purchase orders are to provide design engineering support to implement these ultra-complex designs.
Graham Curren, Sondrel’s CEO, said, “While ASIC design and supply remain at the core of Sondrel's business strategy, we continue to selectively offer our Design Consultancy Services on leading edge designs through our experienced, multi-disciplinary team of engineers. These ultra-complex chip designs need well-established teams who have the experience of working together on leading edge nodes. Sondrel is one of only a handful of design companies with highly experienced, in-house teams with all the tools and design flows in place for working at the leading edge of silicon technology.
“Sondrel has over 130 design engineers which enables it to handle several big chip projects simultaneously by forming teams with the appropriate skill sets for the particular stage of each project such as front end, back end, verification or design for test. We can pull together a team to meet the specific requirements of a customer who needs help keeping complex design projects on schedule.”
Suggested Items
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.