-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Nordson MARCH's Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing
September 21, 2016 | Nordson MARCHEstimated reading time: 2 minutes
Nordson MARCH, a Nordson company, introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
Using the confinement ring, there is a free conduction path between the upper and lower electrodes in the wafer region, but no conduction path in the adhesive tape and wafer frame area. The ring is made with an insulated, non-conductive material, while the aluminum-to-aluminum plasma conduction path is confined to the wafer area. There is a 2mm gap between the ring and the adhesive tape and wafer frame. Because there is no plasma generation or plasma to the bottom of the wafer and adhesive tape, undercutting and delaminating are minimized and there is no sputtering or adhesive tape deposition on the wafer surface.
"The big difference between our concept and most front-end systems is the spacing and confinement method," explained Jonathan Doan, director of marketing, Nordson MARCH. "In our method, we minimize the gap between the ring edge and lower electrode, resulting in a smaller spread area. This gap is roughly 2mm or less, so you only get secondary plasma, rather than primary plasma as you do on other systems. The overall chamber volume is reduced to just the area above the wafer."
The Plasma Confinement Ring is available with Nordson MARCH's SPHERE™ Series of plasma systems. Plasma applications include descum, ashing/photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.
About Nordson MARCH
Nordson MARCH is the global leader in plasma processing technology for the semiconductor, printed circuit board (PCB), microelectronics, and medical & life science device manufacturing industries. Nordson MARCH has offices and laboratories worldwide, including California, Europe, Singapore, China, Japan, Korea and Taiwan. With over 25 years of continuous innovation, Nordson MARCH designs and manufactures a complete line of award-winning and patented plasma treatment systems. An expert staff of scientists and engineers is available to assist in the development of plasma processes that improve product reliability and increase production yields.
About Nordson Corporation
Nordson Corporation delivers precision technology solutions that help customers succeed worldwide. Precision dispensing of adhesives, coatings, sealants, biomaterials, and other fluids, plastic extrusion and injection molding, electronics testing and inspecting, and surface preparation are supported by applications expertise and direct global support. Nordson serves consumer non-durable, durable and high-technology markets, specializing in packaging, nonwovens, electronics, medical, energy, transportation, construction, and product assembly. Founded in 1954, headquartered in Westlake, Ohio, USA, Nordson has operations and support offices in 30+ countries. Connect with Nordson at www.nordson.com and on social media.
Suggested Items
Lockheed Martin Successfully Transitions Long Range Discrimination Radar To The Missile Defense Agency
04/23/2024 | Lockheed MartinThe Long Range Discrimination Radar (LRDR) at Clear Space Force Station in Clear, Alaska, completed DD250 final acceptance and was officially handed over to the Missile Defense Agency in preparation for an Operational Capability Baseline (OCB) decision and final transition to the Warfighter. In addition, prior to this transition, the system has started Space Domain Awareness data collects for the United States Space Force.
Real Time with... IPC APEX EXPO 2024: AI Implementation at Omron
04/18/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson and Omron Product Manager Nick Fieldhouse discuss the company's focus on AI implementation to enhance customer experience and results. They address programming challenges and how AI can help customers achieve better outcomes with less experience. Omron's AI is compatible with existing systems, facilitating easy upgrades.
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).