IPC to Debut Flexible Hybrid PEC Pavilion at IPC APEX EXPO 2017


Reading time ( words)

IPC will debut a new pavilion focusing on flexible hybrid printed electronics at IPC APEX EXPO 2017 in San Diego. IPC APEX EXPO is excited to have a dedicated area to promote flexible hybrid printed electronics and support this growing technology.

The Flexible Hybrid Printed Electronics Pavilion will showcase the growing printed electronics technology sector and how these technologies also apply to hybrid PCBs and PCB assemblies. This will provide IPC APEX EXPO attendees with an opportunity to explore topics and vendors in a centralized location. Visit www.IPCAPEXEXPO.org or contact Maria Labriola, manager of tradeshow sales, MariaLabriola@ipc.org for details on exhibiting.

In addition to the show floor pavilion, the planned Flexible Hybrid Printed Electronics programming will include:

  • Technical paper sessions
  • Management-focused Buzz Session
  • Standards meetings

“Flexible hybrid printed electronics is an area of great interest for IPC APEX EXPO attendees,” said Chris Jorgenson, IPC director of technology transfer. “This pavilion on the show floor and the supporting events during the show will provide a valuable opportunity for attendees to network and learn about these trending products and technologies.”

Registration for IPC APEX EXPO is now open. For more information, please visit www.IPCAPEXEXPO.org

Share

Print


Suggested Items

IPC: Shawn DuBravac and Chris Mitchell on USMCA

07/02/2020 | Nolan Johnson, I-Connect007
On July 1, 2020, the USMCA trade act (United States-Mexico-Canada Act) phased in as a trade agreement guiding economic trade and growth in North America. Nolan Johnson spoke with both Shawn DuBravac, IPC’s chief economist, and Chris Mitchell, IPC’s vice president of global government affairs and an I-Connect007 columnist, about the impact of USMCA on North American electronics manufacturing.

Elmatica’s Didrik Bech Accepts Role as IPC Cybersecurity Task Group Vice-Chair

06/22/2020 | Nolan Johnson, I-Connect007
On June 18, Nolan Johnson spoke with Didrik Bech, Elmatica CEO and I-Connect007 columnist, who was recently selected as vice-chair for IPC’s Cybersecurity Task Group. During their conversation, Didrik outlined the task group’s mission statement and the target audience for its work. He also shared specific examples where cybersecurity is increasingly important to the electronics manufacturing industry globally.

The iNEMI 2019 Roadmap: Flexible Hybrid Electronics

06/04/2020 | Pete Starkey, I-Connect007
The emerging trend for “electronics on everything, everything with electronics” was the theme of iNEMI’s webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, delivered by Girish Wable, senior engineering services manager with Jabil. Pete Starkey provides an overview.



Copyright © 2020 I-Connect007. All rights reserved.