IPC to Debut Flexible Hybrid PEC Pavilion at IPC APEX EXPO 2017


Reading time ( words)

IPC will debut a new pavilion focusing on flexible hybrid printed electronics at IPC APEX EXPO 2017 in San Diego. IPC APEX EXPO is excited to have a dedicated area to promote flexible hybrid printed electronics and support this growing technology.

The Flexible Hybrid Printed Electronics Pavilion will showcase the growing printed electronics technology sector and how these technologies also apply to hybrid PCBs and PCB assemblies. This will provide IPC APEX EXPO attendees with an opportunity to explore topics and vendors in a centralized location. Visit www.IPCAPEXEXPO.org or contact Maria Labriola, manager of tradeshow sales, MariaLabriola@ipc.org for details on exhibiting.

In addition to the show floor pavilion, the planned Flexible Hybrid Printed Electronics programming will include:

  • Technical paper sessions
  • Management-focused Buzz Session
  • Standards meetings

“Flexible hybrid printed electronics is an area of great interest for IPC APEX EXPO attendees,” said Chris Jorgenson, IPC director of technology transfer. “This pavilion on the show floor and the supporting events during the show will provide a valuable opportunity for attendees to network and learn about these trending products and technologies.”

Registration for IPC APEX EXPO is now open. For more information, please visit www.IPCAPEXEXPO.org

Share

Print


Suggested Items

Meet Chris Mitchell, I-Connect007 Columnist

08/14/2019 | I-Connect007
Chris Mitchell is vice president for global government affairs at IPC—Association Connecting Electronics Industries—where he is responsible for development and implementation of the organization’s global advocacy efforts and public policy agenda with a focus on electronics industry business improvement, environment, health and safety, and defense initiatives.

Avoiding CAF Failures at the IPC High-reliability Forum

07/31/2019 | Andy Shaughnessy, I-Connect007
Foresite CEO Terry Munson recently spoke with Andy Shaughnessy during the IPC High-Reliability Forum and Microvia Summit in Baltimore about his presentation on the causes of conductive anodic filament (CAF), the dangers of resin starvation, and what advice he'd give to PCB designers to avoid those types of failures.

Focusing on Surface Sensitivity for Reliability

07/26/2019 | Andy Shaughnessy, I-Connect007
At the recent IPC High-Reliability Forum and Microvia Summit, Customer Applications Scientist Elizabeth Kidd and Sales Engineer Alex Bien, both of BTG Labs, discuss with Andy Shaughnessy their presentation on the challenges of working with highly sensitive surfaces, such as the risk of contamination. They also talked about the various surface characterization techniques that BTG Labs uses to identify such contaminants.



Copyright © 2019 I-Connect007. All rights reserved.