EIPC SpeedNews: News from the European PCB Industry

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News from EIPC

- Review EIPC Reliability Workshop, Tamworth

- What do EMS Providers Sanmina, Eolane, Asteelflash, BMK and Prettl have in common?

- Save the date: EIPC Winter Conference Salzburg, February 2 & 3, 2017

News from Germany

- Digitaltest Germany's success continues with new, expanded production site

News from Italy

- SOMACIS at electronica 2016

News from Switzerland

- Cicor presents: DenciTec – a PCB technology that takes miniaturization to the next level

News from the UK

- Senior industrial engineers join Loughborough University's teaching staff. One of them is Prof. Martin Goosey

- ICT Harrogate Winter Seminar 2016

- Inaugural 'ScoopTalk' Takes Event Video to the Next Level

News from the US

- Ventec International appoints Denis McCarthy Jr. as technical sales account manager

News from Electronica

- Seica SpA participation at Electronica, Munich, November 8–11, 2016

News from WECC Members

- News from IPC

Click here for the International Events Diary 2016

Click here to download the complete SpeedNews Issue 26



Suggested Items

Future Trends in Flying Probe Testing

11/29/2019 | I-Connect007 Editorial Team
Peter Brandt, director of sales for Europe and Japan at atg, sits down with Pete Starkey and Barry Matties, gives his views on market requirements and testing technologies, and explains how flying probe testing is becoming the industry standard at all levels of production—and in many cases, the only practicable solution.

EIPC Winter Conference—Speakers and Papers

11/25/2019 | Andy Shaughnessy, I-Connect007
I recently spoke with Kirsten Smit-Westenberg, executive director of EIPC, who is planning the EIPC winter conference set for February 2020 in Rotterdam, Netherlands. Kirsten discusses the conference topics, which are based around the needs of the next-generation electronic devices, and changes in fabrication solutions for PCBs, PCBAs, materials, and technologies.

Flex Standards Update With Nick Koop

11/21/2019 | Andy Shaughnessy, Design007 Magazine
This month, I interviewed Nick Koop—director of flex technology at TTM Technologies, a veteran “flex guy” and instructor, and a leader of several IPC flex standards committees. Nick provides an update for the committees he’s involved with and discusses some of the challenges that he sees as more designers enter the world of flex.

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