October 2016 Issue of The PCB Magazine Now Available


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The topic of the October 2016 issue of The PCB Magazine is Leadership.  Everyone has the chance to benefit from the wealth of experiences our contributors—leaders in the industry—are sharing this month, from real-world examples of leadership, to principles that have stood the test of time.

Read the October issue of The PCB Magazine now on the virtual newstand and available for delivery in your e-mailbox by subscribing here.

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Suggested Items

Kelvin Characterization to Accurately Predict Copper Thickness

07/01/2019 | Article by Brandon Sherrieb, Integrated Test Corporation
A few years ago at Integrated Test Corporation, we found that the reaction plan for void fallout at electrical test was ineffective and not standardized. Like many PCB manufacturing facilities (including a Sanmina shop that I used to work at), the reaction plan consisted of cross section analysis to determine the void type.

Virtual Verification Station From CIMS Enhances AOI Capabilities

06/28/2019 | Barry Matties, I-Connect007
At this year’s CPCA Show, CIMS Marketing and Technical Director Vladi Kaplan spoke to Barry Matties about a number of add-ons CIMS designed to further enhance their AOI capabilities and systems. He described their Virtual Verification Station (VVS), CIMS Quality Center (CQC), and Software Development Kit (SDK) as well as trends he sees with laser via inspection.

Stacked Microvia Reliability: Ongoing Work and Upcoming IPC Conference

04/24/2019 | Pete Starkey, I-Connect007
One year ago, Happy Holden's review of the 2018 IPC High-Reliability Forum reported the presentation of J.R. Strickland and Jerry Magera, who described research at MSI Applied Technology into overcoming the risk of stacked microvia failures escaping standard quality assurance procedures. Their report provided a basis for the IPC white paper IPC-WP-023, which addressed reliability issues associated with stacked microvias and included data collected from several other printed circuit manufacturers.



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