FCCL Maker Taiflex Reports 19% Revenue Drop in 3Q 2016

Reading time ( words)

Taiflex Scientific Co. Ltd, a provider of flexible copper-clad laminate (FCCL) for the flexible printed circuit industry, has announced consolidated revenues of NT$835 million ($26.56 million) for September 2016, slightly down by 0.7% from the previous month, and lower by 18.8% year-on-year.

Revenues for Taiflex’s Electronic Materials unit totaled NT$633 million ($20.14 million), down by 3.2% year-on-year, mainly due to weakening sales amid the end of the peak season. The Energy Material division posted total sales of NT$199 million ($6.33 million), up by 5.2% MoM.

Consolidated revenue in the third quarter of 2016 reached NT$2.44 billion ($77.6 million ), down by 7% from the previous quarter, and lower by 18.9% compared to the same period last year. The Electronics Materials division achieved 3Q revenue of NT$1.91 billion ($60.76 million), up by 24.1% from the previous quarter, and an increase of 15.7% YoY—another record high for the company. The Energy Materials unit posted 3Q sales of NT$526 million ($16.7 million), down by 50.8% on quarter and 60.2% YoY due to the significant decline in the solar market.



Suggested Items

Vertical Conductive Structures, Part 3: Design Tool Techniques

08/23/2019 | Ed Hickey and Mike Catrambone, Cadence Design Systems, and Joan Tourné, Nextgin Technology
New vertical conductive structure (VeCS) technology can reduce layer count and improve signal integrity without the need for sequential technologies. VeCS is different than traditional through-hole vias, microvias, and ELIC designs, which are more expensive and require a high number of laminations, drilling, and plating cycles to build up a reasonable number of layers.

Solder Mask Curing: UV Bump Overview

08/19/2019 | Nikolaus Schubkegel
Ultraviolet (UV) bump, also called UV cure, is a processing step in which the solder mask pattern is irradiated with ultraviolet and infrared light. This step is performed with special equipment that is built as a continuous flow system, which consists of a conveyor belt and tubular UV lamps mounted above and below the belt. Read on to find out more about this process.

Avoiding CAF Failures at the IPC High-reliability Forum

12/31/1969 | Andy Shaughnessy, I-Connect007
Foresite CEO Terry Munson recently spoke with Andy Shaughnessy during the IPC High-Reliability Forum and Microvia Summit in Baltimore about his presentation on the causes of conductive anodic filament (CAF), the dangers of resin starvation, and what advice he'd give to PCB designers to avoid those types of failures.

Copyright © 2019 I-Connect007. All rights reserved.