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Real Time with... SMTAI: Alex Stepinski is Presented with I-Connect007's First 'Good for the Industry' Award
October 13, 2016 | Real Time with...SMTAIEstimated reading time: Less than a minute
I-Connect007’s Barry Matties and Patty Goldman present the first “Good for the Industry” award to Alex Stepinski of Whelen Engineering for his unique design approach to a fully automated PCB factory. Stepinski achieved a 3-year ROI (including design time) by using or modifying existing technology to fully automate the line and completely eliminate the need for waste permits. Whelen has opened their doors to anyone interested in seeing this line firsthand.
Listen in as Alex tells the story here.
Suggested Items
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/12/2024 | Nolan Johnson, I-Connect007As we publish this week’s most-read news, the I-Connect007 team is wending its way home from an eventful and productive week at IPC APEX EXPO in Anaheim, California. We’ve posted a variety of dispatches from the show this week, released 73 realtimewith.com video interviews (and counting), and also gathered the content and updates you’ll be looking for in the upcoming issue of Show & Tell… IPC APEX EXPO 2024.
Material Insight: The Importance of Standards for the Chip Packaging Industry
04/12/2024 | Dr. Preeya Kuray -- Column: Material InsightI had the great pleasure of recently attending the National Institute of Standards and Technology’s (NIST) CHIPS R&D Chiplets Interfaces Technical Standards Workshop. The purpose was to bring together technical experts across industry and academia to deliberate one of the most pressing technological matters of 2024: chip packaging standards.
What’s New in Design Education at IPC APEX EXPO?
04/11/2024 | Kelly Allen, IPC Training ManagerKelly (Kel) Allen shares her thoughts on the educational offerings at IPC APEX EXPO and beyond. In this interview, she discusses some of the newest classes taking place during the conference in Anaheim, covering everything from design, fab, and assembly through mil/aero, test, and supply chain issues.