-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
IPC Standards Committee Reports – Printed Board Design, Testing, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
November 14, 2016 | IPCEstimated reading time: 3 minutes
These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports.
Printed Board Design
The 1-10b Printed Board Thermal Management Task Group met to discuss future testing programs for the evaluation of parallel conductors and flexible circuits towards an update to the IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design. The proposed testing seeks participation from IPC member companies in conjunction with college and technical university laboratories.
The 1-10c Test Coupon and Artwork Generation Task Group worked towards future updates to the IPC-2221B Gerber Coupon Generator. The Generator allows for the creation of Gerber files for AB/R and D test coupon designs found in Appendix A of IPC-2221B, Generic Standard on Printed Board Design, for plated hole integrity and registration evaluations. A propagated B/R design was discussed that will address additional via structures such as stacked and staggered.
Testing
The 7-12 Microsection Subcommittee met to resolve negative comments to the Proposed Standard for Ballot copy of IPC-9241, Guidelines for Microsection Preparation (formerly IPC-MS-810). A December 2016 release is anticipated.
Flexible Circuits
The D-11 Flexible Circuits Design Subcommittee met to announce the publication of the new IPC-2223D, Sectional Design Standard for Flexible Printed Boards. Additions to this revision address flexible cross-sectional construction examples and factors that affect impedance and capacitance control for flex and rigid-flex printed board applications.
The D-12 Flexible Circuits Performance Subcommittee met to prepare the Final Draft for Industry Review of IPC-6013D, Qualification and Performance Specification for Flexible Printed Boards. The group addressed issues involving adhesive and strain relief fillets, non-lamination and dielectric protrusion within the rigid-to-flex transition zone.
High Speed/High Frequency
The D-21 High Speed/High Frequency Design Subcommittee reviewed a Working Draft for the future IPC-2228, Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards. The group agreed that any relevant design guidance from the older IPC-2251 and IPC-2252 design guide can be rolled into this document and that those two documents would be cancelled upon the release of IPC-2228. While there is certainly a need to address RF/Microwave design for flexible printed circuits, it was agreed that such content should be addressed with the corresponding IPC-2223 design standard for flexible printed boards and that IPC-2228 will reference that document.
The D-22 High Speed/High Frequency Performance Subcommittee met to announce the release of IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards and the corresponding IPC-6018CS Space and Military Avionics Applications Addendum. Both documents are targeted for a Q3 2016 release. These revisions provide updated acceptance criteria for microvia structures and PTFE laminates (e.g. smear removal).
The D-24b Bereskin Test Methods Task Group met work on a new IPC-TM-650 Test Method addressing the Bereskin stripline resonator test method that lends itself to the test and measurement of Dk and Df of thin dielectric materials up to 20 GHz.
The D-24c High Frequency Test Methods Task Group meet to review a proposal for a new IPC-TM-650 test method addressing microstrip differential phase length useful for approximating Dk over a wide range of frequencies.
The new D-24d High Frequency Signal Loss Task Group met for the first time to discuss a proposed test method addressing the quality of measured date for printed boards to meet the demands of high speed applications of 25Gbps and above. The effort will address verification of the accuracy of measured data, calibration and de-embedded techniques, and probing/test fixture choices that impact measurement quality.
Rigid Printed Boards
The D-31b IPC-2221/2222 Task Group met to advance the working draft of IPC-2226A, Sectional Design Standard for HDI Printed Boards, which is the first revision effort for this standard since its original 2003 publication. The group focused on sections and graphics for various structures, included stacked, staggered and variable depth microvias. A Final Draft for Industry Review is planned for release for review and comment by December 2016.
The D-33a Rigid Printed Board Performance Task Group and the 7-31a IPC-A-600 Task Group met jointly to work on a future Revision E to IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, including copper wrap plating, evaluations for surface finishes in production lot testing, back drilling and via fill “plate-to-plate”, often referred to as “double capping”.
The D-32 Thermal Stress Test Methods Subcommittee met to work on revisions to IPC-TM-650 Methods 2.6.7.2, Thermal Shock and 2.6.27, Thermal Stress. The test methods are being updated to address in process electrical resistance measurements of samples during thermal cycling. A significant set of data correlating the electrical resistance measurements to failures occurring during thermal cycling was provided by Jerry Magera of Motorola Solutions.
Suggested Items
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources:
Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
03/05/2024 | MatrixMatrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
The Chemical Connection: Getting to Know Your Vendor
02/16/2024 | Don Ball -- Column: The Chemical ConnectionAfter working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends
02/14/2024 | Pete Starkey, I-Connect007The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.