Real Time With...HKPCA & IPC Show 2016: Rogers Discusses 5G, Power Electronics Trends


Reading time ( words)

At the recent HKPCA and IPC Show 2016 in Shenzhen, China, John Ranieri, business development manager at Rogers Corp., speaks with I-Connect007's Stephen Las Marias about the 5G trend and how it will impact the materials requirements.

He also talks about the thermal management, and how their ML series of laminates is helping customers in the automotive, LED lighting and consumer electronics space address issue.

Watch The Interview Here

Share


Suggested Items

Beyond FR-4: High-Performance Materials for Advanced Designs, Part 1

05/03/2016 | Advanced Circuits
In the past 40-plus years of PCB manufacturing, the primary material of choice has overwhelmingly been e-glass supported FR-4 resin laminates. This is due to the excellent dimensional stability and reasonably acceptable thermal performance (based on glass transition temperature [Tg] and decomposition temperature [Td]). In general, these materials exhibit impressive performance and excellent cost for a wide range of applications.

Coated Ultra-Thin Copper on Printed Circuit Laminates

07/16/2015 | Intrinsiq Materials Inc.
Nano copper-based electronic ink and associated processing have been developed to create ultra-thin copper on flexible PCB substrates, allowing for much finer etch resolution and increased circuit density. The process is rapid and sufficiently low-temperature to allow deposition onto temperature-sensitive substrates such as polyimide, plastic and paper.



Copyright © 2018 I-Connect007. All rights reserved.