Ventec to Showcase Innovations in PCB Materials for High-Speed/Low-Loss Applications at APEX 2017

Reading time ( words)

Ventec International will showcase its latest PCB materials innovations at APEX 2017 on booth #3715, including the industry's most advanced ultra-low Dk PCB materials for high-speed low-loss applications. The show will take place from 14th to 16th February 2017 in San Diego, USA.

Ventec's team of materials experts will present the company's next generation polyimide technology including the latest industry-leading ultra-low Dk PCB materials for high-speed low-loss applications. Further show-highlights will feature advances in high performance IMS materials that deliver an exceptional thermal performance, reliability and quality, particularly demanded by automotive and other LED lighting and DC power conversion applications. Visitors to the booth will also be introduced to the company’s complementary ranges of PCB base-materials including products such as flex- & rigid-flex circuit board materials, back-up, entry & routing materials, foils and coatings.

Jack Patty, President of Ventec's US operation commented: "Our continued global strategic investments in human resources, new technologies and production equipment that expand our product offerings and leverage production resources, enable our customers to enjoy one single access point to an extraordinary portfolio of complementary products & services today. We offer a one-stop-shop-solution, all supported by our global network of manufacturing & service centers linked by a fully owned and controlled global supply chain that ensures product quality, consistency and reliability."

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here. 

05/23/2023 | Barry Matties and Nolan Johnson, I-Connect007

Every industry has a beginning, and we are lucky to have Rex Rozario here to share the story of how the printed circuit board industry got its start. I-Connect007 chatted with Rex recently about how he became involved with circuit board inventor Dr. Paul Eisler.

05/17/2023 | Andy Shaughnessy, Design007 Magazine

At the SMTA Atlanta Expo and Tech Forum, I spoke with NCAB Group Field Application Engineer Ramon Roche, who gave a presentation at the show titled, “Technical Trends in the Global PCB Industry.” Ramon and I discussed his presentation, the emerging technologies that have NCAB’s focus over the next few years, and why semi-additive processes may be the key to succeeding with ultra HDI technology.

05/10/2023 | Pete Starkey, I-Connect007

It’s been a little while since I first had the opportunity to review an EIPC Technical Snapshot webinar. This excellent series began in October 2020 when our industry was besieged by the COVID-19 pandemic. It has continued successfully as restrictions have lifted and provides an effective channel for the efficient sharing of relevant knowledge that complements the traditional live conferences. The 20th in the series, in December 2022, focused on environmental issues impacting the electronics industry. In early February, EIPC held its live Winter Conference in Lyon and now, by popular demand, the 21st Technical Snapshot fills a slot before the Summer Conference scheduled for mid-June in Munich.