-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Nano Dimension Combines Electronic Components within PCBs as part of the Printing Process
January 30, 2017 | Nano Dimension Ltd.Estimated reading time: 1 minute
Nano Dimension Ltd., a leader in the field of 3D printed electronics, announced today that its wholly owned subsidiary, Nano Dimension Technologies Ltd., has successfully 3D printed electrical circuits, in which it embedded electrical components, through placement, as an integral part of the printing process. The company's 3D printer - the DragonFly 2020 - enables 3D printing of PCBs with conductive ink and dielectric ink.
Today, the company announced a successful proof of concept of PCBs inkjet printing, in which electrical components were placed during the printing process. The method presents several advantages:
- It improves the PCB reliability by maintaining the electronic components internally and keeping them from being exposed to the external environment, while protecting them from mechanical, temperature, and corrosion damages.
- It makes obsolete the soldering process since the components are embedded within the printed board during printing. The connectivity between components then takes place as part of the 3D printing process without the need for a mediating soldering material.
- The new process enables printing on electronics components without their complete packaging (printing directly on the dye), and consequently supports the creation of thinner, more protected PCBs.
This new and significant capability is expected to become supported in future versions of Nano Dimension's 3D printers.
The company has filed a patent application with the U.S. Patent and Trademark Office for this unique development, which the company believes is significant for a wide range of industry sectors such as defense, space, consumer products, telco, and more.
About Nano Dimension Ltd.
Nano Dimension, founded in 2012, focuses on development of advanced 3D printed electronics systems and advanced additive manufacturing. Nano Dimension's unique products combine three advanced technologies: 3D inkjet, 3D software, and nanomaterials. The company's primary products include the first 3D printer dedicated to printing multi-layer PCBs (printed circuit boards), and advanced nanotechnology-based conductive and dielectric inks.
In addition to the trading of the company's American Depositary Shares on NASDAQ, the company's ordinary shares are also traded on the TASE in Israel. The Bank of New York Mellon serves as the depositary for Nano Dimension.
Suggested Items
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Apollo Seiko Presents the Next Frontier in Non-Contact Soldering at 2024 IPC APEX EXPO
03/12/2024 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is pleased to announce plans to showcase its latest advancements at Booth 1408 during the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California.
Revolutionizing Soldering: Kurtz Ersa to Debut Cutting-Edge Lineup at APEX
03/12/2024 | Kurtz ErsaKurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce plans to showcase its latest advancements and a range of cutting-edge soldering machines at the 2024 IPC APEX EXPO.
Solderstar to Spotlight the Reflow Shuttle with O2 at IPC APEX EXPO 2024
03/11/2024 | SolderStarSolderstar will introduce the newly launched Reflow Shuttle with O2 measurement module. This product promises to redefine soldering process optimization, offering manufacturers unparalleled control and precision.