Best Technical Paper at IPC APEX EXPO 2017 Selected

Reading time ( words)

The best technical conference paper of IPC APEX EXPO 2017 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 14.

Taking top honors, the winning paper is, “Rework of New High Speed Press Fit Connectors” by Lars Bruno, Ericsson AB. This paper will be presented during Technical Conference Session 34 on Thursday, February 16.

This year, two papers were selected in the honorable mention category. Honorable mention went to, “Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints” by Maxim Serebreni, DfR Solutions. His co-authors were: Nathan Blattau, Ph.D., Gilad Sharon, Ph.D., and Craig Hillman, Ph.D., all of DfR Solutions. This paper will be presented during Technical Conference Session 22 on Thursday, February 16.

Honorable mention also goes to “SIR Intercomparison to Validate the Use of a Fine Pitch Pattern” by Christopher Hunt, Gen3 Systems. The paper was co-authored by Ling Zou, National Physical Laboratory. This paper will be presented during Technical Conference Session 9 on Tuesday, February 14.

The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry. 

To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place including standards development committee meetings, professional development courses, the exhibition and more, click here.


Suggested Items

Institute of Circuit Technology Meriden Seminar, 2018

03/21/2018 | Pete Starkey, I-Connect007
The Institute of Circuit Technology returned to Meriden, traditionally regarded as the centre of England, for its Annual General Meeting, which was followed by a technical seminar of five presentations, introduced as ever by Technical Director Bill Wilkie.

RTW IPC APEX EXPO: IPC—Industry Trends Moving Forward

03/20/2018 | Real Time with...IPC
Sharon Starr, director of market research for the IPC, discusses industry trends moving forward covering both EMS and PCB. She also mentions the upcoming studies IPC will be conducting in 2018.

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

Copyright © 2018 I-Connect007. All rights reserved.