Insulectro Brings Power Chats to Booth at IPC APEX EXPO


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Insulectro has announced it will repeat its successful 13.5 minute power chats during this year’s IPC APEX EXPO at the San Diego Convention Center, February 14 - 16. 

The Insulectro Power Chats, branded ipc@IPC, will provide details on many new products, processes and services for 2017. 

“We are pleased to continue our ipc@IPC - Insulectro Power Chats,” commented Ken Parent, Vice President of Sales & Product Management, “We’ve taken our top four most interesting, new products and processes for 2017 and crafted short, info-packed learning sessions to be presented during IPC APEX EXPO. In no more than 13.5 minutes per topic, attendees will learn the WHAT/WHY/HOW of these game changers. 

“Our new products can change the way a board is designed and fabricated. In our field testing, we’re hearing ‘We could have never made this board before’,” continued Parent. “We’re anxious to share our process information about our offerings in very concise power chats in our booth (Space 3733/3833).” 

Insulectro Vice President of Technology Chris Hunrath agrees, “Over the past four years our IPC Power Chats have been enormously popular. Often, it’s standing room only. That’s due to the intriguing topics we spotlight in our chats and in our booth. This year is no exception. For instance, although IPC APEX is primarily a PCB industry tradeshow, we know many of our customers are interested in printed electronics so we’ve included a 13.5 minute Boot Camp on PE. Other topics include High Speed Digital Laminates from Isola, Inner layer Cleaning for Shiny Copper, DuPont Yieldmaster Wet Lamination, and a session on Insulectro’s new Customer Portal and our PumaFast™ inventory stocking program that focuses on getting materials to customers faster.” 

IPC@IPC Product Power Chats Schedule for Booth 3733/3833: 


TUESDAY, FEBRUARY 14  


11:00 am

Isola High Speed Digital Laminates 

Isola’s process-friendly low-loss, high-reliability laminate systems 

Norm Berry, Director of Laminates & OEM Marketing

 

1:00 pm              

Inner Layer Cleaning for Shiny Copper 

Optimized copper cleaning before dry film lamination

Chris Hrusovsky, Vice President of Sales & Chemistry

 

2:00 pm 

DuPont Yieldmaster® Wet Lamination 

Using VLP Copper? Try Wet Lam for increased signal integrity. 

Michelle Walsh, Director of Product Management 

 

3:00 pm             

Printed Electronics 101 

Want to learn about Printed Electronics? Give us 13.5 minutes. 

Chris Hunrath, VP Technology & Jeff Parker, PE Product Specialist

 

4:00 pm             

Laminate Inventory Portal & PumaFast™ Program 

Everyday materials you need every day. 

Dan Diesel, Vice President - Business Strategy & CIO 

 

WEDNESDAY, FEBRUARY 15 

 

11:00 am    

Laminate Inventory Portal & PumaFast™ Program

Everyday materials you need every day.

Dan Diesel, Vice President - Business Strategy & CIO

 

1:00 pm             

Printed Electronics 101

Want to learn about Printed Electronics? Give us 13.5 minutes.

Chris Hunrath, VP Technology & Jeff Parker, PE Product Specialist

 

2:00 pm          

DuPont Yieldmaster® Wet Lamination

Using VLP Copper? Try Wet Lam for increased signal integrity.

Michelle Walsh, Director of Product Management

 

3:00 pm

Isola High Speed Digital Laminates

Isola’s process-friendly low-loss, high-reliability laminate systems

Norm Berry, Director of Laminates & OEM Marketing

 

4:00 pm             

Inner Layer Cleaning for Shiny Copper

Optimized copper cleaning before dry film lamination

Chris Hrusovsky, Vice President of Sales & Chemistry

 

All Power Chats are in Space 3733/3833 at IPC APEX EXPO. No sign-up required.

 

About Insulectro

Insulectro is the largest supplier of PCB and printed electronics materials. With ten stocking locations across North America, Insulectro supplies advanced engineered materials manufactured by DuPont®, Isola, LCOA®, CAC, Inc., Pacothane, Oak Mitsui, Shikoku, Focus Tech Process Chemistry, and Ormet Sintering Pastes. These products are used by its customers to fabricate complex, multilayer circuit boards in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military, and medical. For more information, click here.

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