-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Long-time IPC Volunteer Doug Pauls Inducted into IPC Hall of Fame
February 17, 2017 | IPCEstimated reading time: 2 minutes
In recognition of his extraordinary contributions to IPC and the electronics industry, Doug Pauls, principal materials and process engineer, Rockwell Collins, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® on Tuesday, February 14 at the San Diego Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.
Pauls has served as an active volunteer and leader for IPC and the electronics manufacturing industry for nearly 30 years. Presently, he is chair of the Conformal Coating Requirements Task Group and had served as General Chairman of IPC’s Cleaning and Coating Committees for 10 years and has led IPC efforts in bare board cleanliness, solder mask, surface insulation resistance (SIR), chemical characterization, conformal coating, cleaning processes, and materials and process compatibility testing.
In addition, he has served as a U.S. representative to ISO and IEC working groups on SIR and electro-migration reliability standards. He has also participated in numerous national and international consortia on electronics manufacturing materials and processes. He was an instrumental contributor to IPC-CC-830, Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies as well as the development and revision of the IPC handbook on conformal coating, IPC-HDBK-830, Guidelines for Design, Selection, and Application of Conformal Coatings.
In 1997, Pauls earned an IPC President’s Award for his contributions to IPC standards development, and in 2012 was elected to chair IPC’s top standards development oversight committee, the Technical Activities Executive Committee for a two-year term.
"IPC is privileged to have Doug as such an active member of so many committees and deeply experienced with technical issues that impact our industry," said John Mitchell, IPC president and CEO. "This Hall of Fame tribute is in recognition of all his years of diligent volunteer work, helping to advance the electronics industry and IPC."
For more information on the IPC Hall of Fame and other awards presented at IPC APEX EXPO, contact Sandy Gentry, IPC communications manager, at +1 847-597-2871 or SandyGentry@ipc.org.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,900 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.