Real Time with...IPC: Don Veri on Meyer Burger's Latest Inkjet Developments


Reading time ( words)

Don Veri, sales and business development for Meyer Burger, discusses the company's newest inkjet technology, as well as their focus on printed electronics.

 

Share

Print


Suggested Items

CES 2020: Here We Are Again

01/07/2020 | Dan Feinberg, Technology Editor, I-Connect007
Here we are again at what is probably the largest and most fascinating technology event globally—CES. It is hard for me to believe that as a post-semi-retirement activity for me, I have been attending and writing about CES for over 20 years. The much progress that has taken place is immense, and the rate of change has also accelerated.

Calumet Electronics and Averatek Team Up on A-SAP

12/02/2019 | Nolan Johnson, PCB007
Nolan Johnson talks with Brian Hess of Calumet Electronics and Mike Vinson of Averatek about the new, insertable additive processes that the companies are working on together to help factories running primarily subtractive processes to quickly convert to very high-density interconnect (HDI) features, including trace and space from 2.5-mil line and space to 1-mil line and space and below.

Vertical Conductive Structures, Part 4: Tuning Your Signal Performance

11/18/2019 | Joan Tourné, NextGIn Technology BV
The objective of this article is to demonstrate the possibility of using a stitching element as an alternative to the point-to-point connections that are used with traditional via technology. Point-to-point connections have the best performance in terms of signal integrity (one via less in the connection that distorts the signal). A via is mainly a capacitive element that causes signal loss/ dispersion.



Copyright © 2020 I-Connect007. All rights reserved.