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Lab Circuits has substantially expanded the capacity of its Machining Department with the deployment of a new Laser CombiDrill unit made by the German firm Schmoll Maschinen.
The main features of the CombiDrill are:
- Implementation of a dual system that combines a UV laser with high-frequency pulses of up to 20 W with a CO2 laser. By combining both of these in this way, high-quality and efficient drilling can be performed.
- A CCD camera recording system with LED ring-light achieves optimum contrast and there is an advanced system to correct the panel’s offset, rotation, dilation, and shrinkage.
- An automatic process control system. Variations in the surface’s height and panel thickness are recorded and automatically compensated for.
- An integrated loading/unloading process for the panels that allows us to increase production capacity.
Xavier Angel, the technical director at Lab Circuits, was sure that ‘this unit marks a very significant step forward and will undoubtedly allow us to take on new challenges and provide solutions to the most technologically demanding problems, both in terms of the development of HDI technology, as well as for the processes of cutting special materials for the manufacture of Rigiflex’.
Denis Jacques, Technic Inc.
About three decades ago, immersion silver, a nitrate-based process, gained a lot of market share in the world of PCB final finishes. More economical than ENIG, flat, solderable, and conductive, it had everything going for it—everything but corrosion resistance in a harsh environment, that is. Champagne voids were also an issue, along with line reduction. But the worst drawback, the characteristic that made the part short over time, was creep corrosion. A build-up of copper sulfide salt that grows in contact with a sulfur-rich environment, heat, and moisture resulted in failures in the field. This was enough to scar the process for good.
Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.
I-Connect007 Editorial Team
The I-Connect007 Editorial Team speaks with Technica’s Frank Medina, Ed Carrigan, and Jason Perry about trending hotspots that provide the PCB fabricator a high return on investment (ROI). A theme that carries throughout the conversation is that traditional methods for calculating ROI are being replaced by models that include more qualitative factors.