AT&S Advances PCB, Module and Packaging Technologies


Reading time ( words)

For years, AT&S has worked at the forefront of process and technology development to meet the challenges of continued miniaturization and the demand for better energy efficiency. In this context, the company is involved in various research and development programmes. One current example is the Horizon 2020 EU Research and Innovation programme, in which 11 key European actors are collaborating on the GaNonCMOS project. AT&S is also participating in the Panel-Level Packaging Consortium managed by Fraunhofer IZM. 

Optimized energy efficiency with GaN 

Over the next four years, the GaNonCMOS project consortium – including AT&S – intends to develop cost‑effective and reliable GaN-based processes, components, modules and integration approaches. In particular, the project aims to exploit the energy-efficiency advantages of GaN (gallium nitride), targeting the production of several demonstrators with GaN power switches and CMOS drivers, as well as new magnetic core materials that will enable switching frequencies up to 200 MHz. Together with optimized embedded PCB technology, the developments should lead to new integrated power components for low-cost, high-reliability systems. Working alongside AT&S on this project are the University of Leuven, Epigan, Fraunhofer, IBM Research, IHP, Tyndall National Institute, PNO Innovation, Recom, NXP Semiconductors and X-FAB Semiconductor. 

Advancing miniaturisation with panel-level packaging 

The Panel-Level Packaging Consortium has also now been formed. It comprises internationally leading partners such as Intel, ASM Pacific, Hitachi Chemical, AT&S, Evatec, Nanium, Süss MicroTec, Unimicron, Brewer Science, Fujifilm Electronic Materials U.S.A., ShinEtsu, Mitsui Chemicals Tohcello and Semsysco. Together with Fraunhofer IZM as the development hub, the plan is to implement fan-out panel-level packaging (FOPLP), one of the newest packaging trends in microelectronics. FOPLP has a very high miniaturisation potential in both package volume and package density. 

During the consortium’s two-year term, known technological elements in wafer-level packaging will be transferred to a large panel format. The technological basis for FOPLP is a reconfigured, moulded panel with embedded components and a thin-film redistribution layer, which together yield an SMD-compatible package. The main advantages of FOPLP are a very thin, substrateless package, low thermal resistance, and good RF characteristics. In addition, passive components such as capacitors, resistors, inductors and antenna structures can be integrated into the redistribution layer. This makes the technology suitable for creating multi-chip packages and System-in-Packages (SiPs). 

Based on a panel size of 18″ x 24″ (a PCB manufacturing standard) or even larger sizes, lower packaging costs can be achieved thanks to higher productivity.

Share


Suggested Items

Automation and Traceability Critical for High-Throughput Probe Testing

12/27/2017 | Barry Matties, I-Connect007
Peter Brandt, atg’s director of sales for Europe, India and Japan, joined Barry Matties at productronica to share his views on regional variations in electrical testing requirements, automation, traceability, and how to anticipate and satisfy the future demands of the market. Group general manager Dr. Jochen Kleinertz also comments on the need for close cooperation with customers to guide the R&D effort.

A Unique Norwegian Approach to Serving Customers

12/21/2017 | Patty Goldman, I-Connect007
I met a lot of interesting people at productronica, with an assortment of different products on display. Such was my visit with Oyvind Tafjord, CEO of Visitech. His purpose at the show was to meet with his customers, so nothing unusual about that. But his customers also had booths (or stands, as they call them), which is an advantage for him, as he explains here.

AGFA: From Film to Inkjet Solder Mask

12/20/2017 | Patty Goldman, I-Connect007
The productronica show was indeed filled with new technology, and it was great to meet with people and learn about it. This is precisely how I met AGFA’s Frank Louwet, who filled me in on the Dipamat inkjet solder mask they have been developing. It seemed an odd choice to go from film to solder mask, but as Frank explained, it makes perfect sense.



Copyright © 2018 I-Connect007. All rights reserved.