RTW IPC APEX EXPO: Impact of Cross-Hatched Ground Planes on HF Electrical Performance of Flex Circuits


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Understanding the electrical performance of flexible circuits at high-end digital transmission frequencies presents a growing challenge. The HDPUG High-Frequency Flex project is studying the effect of different design features, specifically cross hatched ground planes, on signal integrity for flexible printed circuit boards operating at frequencies up to 20 GHz. Jonathan Weldon, RF Applications Engineer at DuPont Electronic Materials, discusses some of the results of the program.

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