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iNEMI is hosting free webinars to introduce the 2017 Roadmap to the electronics industry professionals. This latest biennial roadmap features chapters developed by prominent OEMs that forecast the business and technical needs of seven different product sectors.
The latest edition of the iNEMI roadmap will go on sale in April. In line with this, iNEMI will be previewing highlights from select chapters in two webinars, the schedules of which are as follows:
- Asia (April 6): Internet of Things (IoT) and Packaging & Components Substrates chapters
- North America/Europe (April 7): IoT and Sustainable Electronics chapters
The 2017 iNEMI Roadmap is said to be the most comprehensive to date. This latest edition is planned to contain 28 chapters (the largest to date) and includes, for the first time, a chapter on IoT.
For more information or to register to the free webinars, click here.
EIPC Winter Conference 2023, Day 2 Review
02/28/2023 | Pete Starkey, I-Connect007
Day 2 of the EIPC Winter Conference at the Groupama Stadium in the Décines-Charpieu region of the Metropolis of Lyon in eastern France included a privileged visit to the Bugey Nuclear Power Plant for those who were registered and passed their security clearance. Such was the interest that the party was split into morning and afternoon groups. EIPC board member Martyn Gaudion, CEO of Polar Instruments, made a fine job of moderating Session 6 twice over.
EIPC Winter Conference 2023: Day 1 Review
02/27/2023 | Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.
Plating on Silver: What’s Old is New Again
07/07/2022 | Denis Jacques, Technic Inc.
About three decades ago, immersion silver, a nitrate-based process, gained a lot of market share in the world of PCB final finishes. More economical than ENIG, flat, solderable, and conductive, it had everything going for it—everything but corrosion resistance in a harsh environment, that is. Champagne voids were also an issue, along with line reduction. But the worst drawback, the characteristic that made the part short over time, was creep corrosion. A build-up of copper sulfide salt that grows in contact with a sulfur-rich environment, heat, and moisture resulted in failures in the field. This was enough to scar the process for good.