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Conventional solder resists are relatively poor conductors of heat, but dense PCB assemblies generate heat that needs to be dissipated by all means possible. Don Monn, business development and European sales manager for Taiyo America, introduces a ceramic-filled formulation that increases thermal conductivity by a factor of 10 or more.
Watch the interview here.
Patty Goldman, I-Connect007
While walking around the PCB hall at productronica, I was approached by my good friend Gene Weiner. Gene emphatically directed me to the Elga booth to find out about their new extra-thick dry film that can image extremely fine features with a perfectly perpendicular sidewall. Elga Europe CEO Giorgio Favini filled me in on the details.
Barry Matties, I-Connect007
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.
Jan Pedersen, ELMATICA
IPC’s Automotive Addendum task group was started in November 2014 and the first edition of IPC 6012-DA was released in April 2016. We are now working on the revised version, and expect a release in Q2 2018. As standards need to evolve, develop and follow the needs of the industry, this work is continuous.