RTW IPC APEX EXPO: HDPUG Discusses the Impact of Copper Bonding Treatment on Signal Integrity


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Jim Fuller, vice president of engineering and technology development at Sanmina, gives an insight on how HDPUG, the High Density Packaging User Group, shares the experience and resources of member companies to tackle projects and get results, and reviews the study of the effect of copper bonding treatment on signal integrity.

 

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