MacDermid Enthone to Present 'Copper Filled Thermal Vias for Heat Management' at SMTA Conference


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MacDermid Enthone Electronics Solutions will present at the SMTA South East Asia Technical Conference on Electronics Assembly being held in Penang, Malaysia, March 28-30, 2017.

Economical methods for thermal management of high density circuitry has become critically important as more powerful heat-generating IC and LED substrates are packaged on increasingly small HDI interconnect constructions. Rich Bellemare, Metallization Applications Manager, will discuss various methods of transferring heat away from sensitive components, including direct attachment of heat sinks, metal core printed circuits boards, conductive paste filled vias, and electroplated thermal vias. Rich will present his paper “The Effects of Board Design on Electroplated Copper Filled Thermal Vias for Heat Management“ on Wednesday March 29 at 4:30pm.  This paper will discuss the use of copper filled thermal vias utilizing a two step electroplating process as a means of heat dissipation to improve product performance, efficiency, and life.

The SMTA is a global association with a membership at a local level and is comprised of international professionals who build skills, share practical experiences, and develop solutions through best practices and real world solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

About MacDermid Enthone Electronics Solutions

MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things, you don’t – MacDermid Enthone is there. Visit us at: http://www.macdermidenthone.com/

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