EIPC SpeedNews: News from the European PCB Industry


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News from the EIPC

- Extended deadline - April 7: Call for papers EIPC Summer Conference Birmingham, Solihull, June 1-2, 2017

News from Germany

- SMT Hybrid Packaging 2017: New hall occupation and additional joint stand

- FED e. V. Herausforderungen im Elektronik-Design meistern

- Optimal optical 3D solder joint measurement from Viscom

News from the Netherlands

- 8th Electronic Materials and Processes for Space (EMPS) Workshop ESA/ESTEC

- DIS Technology Inc. and Adeon Technologies BV announce cooperation

News from the UK

- ICT 43rd Annual Symposium at the Black Country Museum

News from the USA

- Two Webinars Will Preview the 2017 iNEMI Roadmap

- HDP User Group New Project Starts

Electronics Industry News

- Welcome to the Age of Continuous Innovation, Gary Grossman, Futurist at Edelman

News from WECC Members

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 10

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