EIPC SpeedNews: News from the European PCB Industry

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News from the EIPC

- Extended deadline - April 7: Call for papers EIPC Summer Conference Birmingham, Solihull, June 1-2, 2017

News from Germany

- SMT Hybrid Packaging 2017: New hall occupation and additional joint stand

- FED e. V. Herausforderungen im Elektronik-Design meistern

- Optimal optical 3D solder joint measurement from Viscom

News from the Netherlands

- 8th Electronic Materials and Processes for Space (EMPS) Workshop ESA/ESTEC

- DIS Technology Inc. and Adeon Technologies BV announce cooperation

News from the UK

- ICT 43rd Annual Symposium at the Black Country Museum

News from the USA

- Two Webinars Will Preview the 2017 iNEMI Roadmap

- HDP User Group New Project Starts

Electronics Industry News

- Welcome to the Age of Continuous Innovation, Gary Grossman, Futurist at Edelman

News from WECC Members

Click here for the International Events Diary 2017

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