EIPC SpeedNews: News from the European PCB Industry

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News from the EIPC

- Extended deadline - April 7: Call for papers EIPC Summer Conference Birmingham, Solihull, June 1-2, 2017

News from Germany

- SMT Hybrid Packaging 2017: New hall occupation and additional joint stand

- FED e. V. Herausforderungen im Elektronik-Design meistern

- Optimal optical 3D solder joint measurement from Viscom

News from the Netherlands

- 8th Electronic Materials and Processes for Space (EMPS) Workshop ESA/ESTEC

- DIS Technology Inc. and Adeon Technologies BV announce cooperation

News from the UK

- ICT 43rd Annual Symposium at the Black Country Museum

News from the USA

- Two Webinars Will Preview the 2017 iNEMI Roadmap

- HDP User Group New Project Starts

Electronics Industry News

- Welcome to the Age of Continuous Innovation, Gary Grossman, Futurist at Edelman

News from WECC Members

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 10


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Knowledge: At the Heart of Great Customer Service

05/26/2023 | Barry Matties, I-Connect007
David Thomas, master IPC trainer at EPTAC, says that the more you understand the work and technology that go into your processes and products, the better you can serve your customers. That includes knowing the basics.

Chemical Legislation and Restrictions on Solder Masks

04/27/2023 | Chris Wall, technical director, Electra Polymers
Ever since liquid photoimageable solder masks (LPISMs) were introduced, their UV exposure speed has been a key factor in their performance. The LPISM is coated onto the PCB, dried, and then selectively exposed with UV light via a phototool, or more recently, via direct imaging using LED or lasers. The exposed areas polymerise and become insoluble in the developing solution. The polymerisation is initiated by one or more chemicals called photoinitiators, which are components of the LPISM.

ICT Seminar 2023 Review: Energy, Thermals, and Assistive Technology

03/16/2023 | Pete Starkey, I-Connect007
Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.

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