SelectConnect Technologies Publishes White Paper on Laser Direct Structuring

Reading time ( words)

SelectConnect Technologies has published the white paper, “Trace Width and Space Limitations for Laser Direct Structuring.” The white paper details a study that was conducted to determine how close laser direct structuring (LDS) traces can be created and metallized without inducing over plating or bridging on PET/PBT material. 

A geometric pattern with varying trace widths and spacing distances were structured onto plaques made from the three different materials.  The plaques were subsequently plated with copper, nickel, and immersion gold and examined for signs of over plating.  Trace widths and spacing were measured using video microscopy equipment. 

Laser direct structuring (LDS) is the first step of a manufacturing process that creates circuit traces on three-dimensional molded thermoplastic components.  Currently the leading technology for producing cell phone antennas, LDS has also been widely employed to manufacture a range of components for use in medical devices, security shields, automotive sensors, and GPS antennas-- anywhere product miniaturization requires embedding circuits onto a molded component of a device. 

About SelectConnect Technologies

SelectConnect Technologies specializes in the production of three-dimensional molded interconnect devices (3D-MID), offering both laser direct structuring (LDS) and 2-shot injection capabilities. Working with LPKF since 2010, the company has produced thousands of laser direct structured components for a wide range of applications. With expertise in electroless metallization, SelectConnect also produces molded interconnect device plating to construct circuitry with the comparable function and performance of a printed circuit board. 

To read and download the white paper, please click here or email


Suggested Items

Institute of Circuit Technology Meriden Seminar, 2018

03/21/2018 | Pete Starkey, I-Connect007
The Institute of Circuit Technology returned to Meriden, traditionally regarded as the centre of England, for its Annual General Meeting, which was followed by a technical seminar of five presentations, introduced as ever by Technical Director Bill Wilkie.

Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review

02/21/2018 | Pete Starkey, I-Connect007
The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.

The Benefits of Coming Together to Form a Global Reach

01/16/2018 | Patty Goldman, I-Connect007
At productronica, MacDermid Enthone Electronics Solutions and Alpha Assembly Solutions had one large combined booth to promote the companies’ integration. Over a buttered pretzel (don’t knock it until you’ve tried it), we talked about the newly amalgamated company, something everyone in the company is quite enthusiastic about.

Copyright © 2018 I-Connect007. All rights reserved.