April Issue of The PCB Magazine is Available Now

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This month in the April 2017 issue of The PCB Magazine the topic is speed, as in high-speed materials.

Do we really need more speed in our connections? If we want autonomous cars, intelligent robotics, extended IoT, then we must press forward with the development of high-speed materials. Our contributors this month examine our industry’s need for speed. 

Read the April issue of The PCB Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.


Suggested Items

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

Weiner’s World—August 2017

09/04/2017 | Gene Weiner, Weiner International Inc.
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.

Laser Patterning & Metallization to Reduce Process Steps for PCB Manufacturing

08/29/2017 | Joel Schrauben, Cameron Tribe, Christopher Ryder and Jan Kleinert, ELECTRO SCIENTIFIC INDUSTRIES
This paper details a new methodology for the plating of conductive features onto glass dielectrics. A laser is used to ablate material from a glass substrate in the desired pattern, and copper is “seeded” into these features using laser-induced forward transfer of a copper foil.

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