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This month in the April 2017 issue of The PCB Magazine the topic is speed, as in high-speed materials.
Do we really need more speed in our connections? If we want autonomous cars, intelligent robotics, extended IoT, then we must press forward with the development of high-speed materials. Our contributors this month examine our industry’s need for speed.
Read the April issue of The PCB Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.
Patty Goldman, I-Connect007
While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.
Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
Gene Weiner, Weiner International Inc.
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.