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This month in the April 2017 issue of The PCB Magazine the topic is speed, as in high-speed materials.
Do we really need more speed in our connections? If we want autonomous cars, intelligent robotics, extended IoT, then we must press forward with the development of high-speed materials. Our contributors this month examine our industry’s need for speed.
Read the April issue of The PCB Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.
Gene Weiner, Weiner International Inc.
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.
Joel Schrauben, Cameron Tribe, Christopher Ryder and Jan Kleinert, ELECTRO SCIENTIFIC INDUSTRIES
This paper details a new methodology for the plating of conductive features onto glass dielectrics. A laser is used to ablate material from a glass substrate in the desired pattern, and copper is “seeded” into these features using laser-induced forward transfer of a copper foil.
Doug Sober, Essex Technologies Group, with Stephen Tisdale, Tisdale Environmental Consulting LLC
There, I said it. Technical Committee 111 of the International Electrotechnical Commission (IEC) is preparing to effectively ban PTFE (polytetrafluoroethylene) materials from electronics. As history goes, the electronics industry has focused on only two of the four halogens (bromine and chlorine) to be limited in order to be called “halogen-free” or more accurately “low-halogen.” But now, fluorine is being dragged down too, just because of its location in the periodic table.