SAE Circuits Express Installs New NTO Lead Free Hot Air Level Machine


Reading time ( words)

SAE Circuits Express has installed a new NTO 2424-LF lead-free hot air solder leveling machine. This machine is recipe driven and will provide industry-leading coating consistency and surface finish. This equipment has undergone final process validation and is fully operational and released into production. The NTO machine will give SAE Circuits Express the in-house capability for lead free HASL coating and gives us the ability to meet our customer's demand for lead free HASL PCBs in as little as 48 hrs.

Dan Spencer, Director of Operations of SAE Circuits Express, stated, “Working with David Dye of Quickturn Inc. to secure this machine was an excellent experience. Dave was able to get us a machine quickly, the installation went very smoothly and we were up and running in a week from delivery.”

Spencer went on to say, “The addition of this process to our in-house stable of surface finishes has enabled us to satisfy a number of our customer's requests for lead-free HASL boards in compressed lead times and is one more step in the evolution of SAE Circuits Express to an industry-leader in quick turn and high-mix lower volume printed circuit production.”

Eric Overman, owner of Netherlands-based New Technology Overman commented, “It was a pleasure to install this HASL NTO-2424LF machine at SAE Circuit express in Boulder(CO). SAE did a great job preparing for this project making it a very smooth install for us. “ 

About New Technology Overman (NTO)

New Technology Overman specializes in designing, developing, drawing and manufacturing of mechanical parts, machines, and equipment for surface treatment processes in the PCB industry, specializing in HASL machines and automatic or manual vertical plating lines. For more information, click here.

Share

Print


Suggested Items

ICT Autumn Seminar Review: Live in 2021!

12/07/2021 | Pete Starkey, I-Connect007
Faced with the choice between a real or virtual event, Bill Wilkie took a calculated risk. It has been many long months since members of the Institute of Circuit Technology had gathered together under one roof, but a fair-sized bunch of industry stalwarts braved the weather and the threat of COVID, descended on the Manor Hotel in Meriden, UK, on Nov. 30, and applauded Bill’s decision to go live. They were not disappointed; the program was superb, the atmosphere upbeat, and the networking opportunity priceless.

Benchmarking Your Process Engineering

04/29/2021 | I-Connect007 Editorial Team
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

EIPC Technical Snapshot: 5G and Loss Minimisation

03/26/2021 | Pete Starkey, I-Connect007
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!



Copyright © 2021 I-Connect007. All rights reserved.