Conductor Analysis Technologies (CAT) Provides Test Systems to TTM Technologies


Reading time ( words)

Conductor Analysis Technologies (CAT) has announced the sale of two OM Thermal Stress Systems to TTM Technologies, Sterling Virginia. “This is a significant step in the adoption of reflow simulation for bare board acceptance by the industry,” said Tim Estes, Chief Technology Officer at CAT. 

The OM Thermal Stress System is a cost-effective performance-based reliability test methodology which performs both convection reflow assembly simulation per IPC TM-650 2.6.27 and air-to-air thermal cycling per IPC TM-650 2.6.7.2. The system is configured to perform 230°C and 260°C reflow simulation, as well as -55° to +125°C thermal cycling.

According to Nick Meeker, Chief Operating Officer at CAT, “We have installed a number of test system at OEMs and test laboratories, however this is the first installation at a printed circuit board manufacturer. The systems are scheduled to be installed and operational by mid-August.” 

About Conductor Analysis Technologies, Inc.

Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by designers, purchasers, assemblers, and manufacturers of printed circuit boards, and by material and equipment suppliers to the printed circuit industry. Our products and services provide quantitative data on printed circuit manufacturing capability, quality, and reliability. For more information, click here.

Share

Print


Suggested Items

CES: The Main Halls

01/28/2020 | Dan Feinberg, Technology Editor, I-Connect007
CES 2020 is now over, and the next round of shows is underway (NAMM is also over now, IPC APEX EXPO is next week, followed by AWE and others). CES displayed electronics related to gaming, monitors, computers, smartwatches, TVs, vehicles, cellphones, etc. However, the effect on the industry and the way we live will be felt until the next CES. The largest and most influential participants are usually found at the Las Vegas Convention Center.

Fresh Thinking on the Logistics of Laminate Distribution

01/28/2020 | Barry Matties, I-Connect007
Mark Goodwin, COO of Europe and the Americas for Ventec International Group, sits down with Barry Matties to explain his approach to supply chain management, efficient distribution, and maintaining definitive product identity at every stage.

IPC APEX EXPO Technical Session Preview

01/27/2020 | Nolan Johnson, PCB007
Brook Sandy-Smith, IPC technical conference program manager, previews the technical side of IPC APEX EXPO 2020, which includes the customary technical sessions, but also some new wrinkles like the fundamentals program and “sessions @ the intersection” to encourage more interaction.



Copyright © 2020 I-Connect007. All rights reserved.