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EIPC has announced that Thomas Hofmann of Hofmann Leiterplatten GmbH has received a prestigious Best Paper award at the 14th Electronic Circuits World Convention (WECC) held at the Korea International Exhibition & Convention Center (KINTEX) in Goyang City, South Korea in April 2017.
Hofmann's paper, "Sharing Experience in Embedding of Active and Passive Components in Organic PCBs for More Reliability and Miniaturization," received the award in the field of Application of Technology. Hofmann is a long-standing EIPC member and is to be congratulated for his highly informative and important contribution to the World Convention technical programme.
Look for this paper in the June issue of The PCB Magazine.
Manuel Herrera, Ohmega Technologies, Inc.
There has been a growing adoption of NiP thin film resistors as heater elements from a diverse group of users including those in the aerospace, defense, high-end computing and the volume consumer electronics market. A novel application has now grown from the validation and reliability testing perspective. Using embedded resistors as heaters to do high-temperature or burn-in testing eliminates the need for thermal chambers.
Barry Matties, I-Connect007
Barry Matties speaks with Optomec’s Pascal Pierra about their LENS printer systems and Aerosol Jet technology, which allows manufacturers to print applications like sensors and antennas on 3D objects. The process is significantly faster and greener than competing technologies.
Wouter Brok, et al, Meyer Burger B.V.
When the Germans coined the term Industry 4.0 back in 2011, it wasn’t clear to many what it actually stood for. Although the debate about all the nuances of the term’s meaning is still ongoing, one aspect of it is undisputed: The “computerization of manufacturing” is at the heart of it.