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EIPC has announced that Thomas Hofmann of Hofmann Leiterplatten GmbH has received a prestigious Best Paper award at the 14th Electronic Circuits World Convention (WECC) held at the Korea International Exhibition & Convention Center (KINTEX) in Goyang City, South Korea in April 2017.
Hofmann's paper, "Sharing Experience in Embedding of Active and Passive Components in Organic PCBs for More Reliability and Miniaturization," received the award in the field of Application of Technology. Hofmann is a long-standing EIPC member and is to be congratulated for his highly informative and important contribution to the World Convention technical programme.
Look for this paper in the June issue of The PCB Magazine.
Saminda Dharmarathna, et al.
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors.
Patty Goldman, I-Connect007
I went to my second IMPACT Washington, D.C. event this year (May 1–3) and, as much as I applauded last year’s event, this one far surpassed it—just ask anyone who was there. In this month’s issue, a special section on IMPACT backs that claim.
Manuel Herrera, Ohmega Technologies, Inc.
There has been a growing adoption of NiP thin film resistors as heater elements from a diverse group of users including those in the aerospace, defense, high-end computing and the volume consumer electronics market. A novel application has now grown from the validation and reliability testing perspective. Using embedded resistors as heaters to do high-temperature or burn-in testing eliminates the need for thermal chambers.