Tianma Selects Orbotech Solutions for its Flex AMOLED Gen 6 Fab


Reading time ( words)

Orbotech Ltd. announced today that Tianma Micro-electronics Co. Ltd., a producer of display solutions with over three decades of experience in the Flat Panel Display (FPD) field, has selected Orbotech's ArrayChecker and Automated Optical Inspection (AOI) solutions for its production line upgrade to flexible AMOLED technology. 

Tianma has invested approximately $1.8 billion to extend its Gen 6 AMOLED fab in Wuhan, China. The Wuhan fab is designed for the production of flexible AMOLED display panels which are rapidly gaining popularity in consumer electronics devices.  When the new line ramps up to mass production during the second half of 2017, Tianma expects to achieve capacity of 30,000 panels per month, with an additional 30,000 per month capacity increase in 2018.

According to the IHS Display Long-Term Demand Forecast Tracker Q4 2016, "AMOLED's share of overall FPD revenue will increase to almost 30% in 2023. Revenue from AMOLED displays is expected to grow from $15 billion in 2016 to $36 billion in 2023 for a CAGR of 17%."

"We are delighted that Tianma has selected our solutions for their flex AMOLED fabrication line," stated Mr. Edu Meytal, President of Orbotech Pacific Display.  "These solutions, which were designed to enable the new manufacturing processes required to produce flex AMOLED displays, will enable our customers to produce the most advanced FPD products available with high yields.  This deal builds upon past successful implementations of Orbotech's inspection, testing and repair solutions."

About FPD Automated Optical Inspection (AOI)

Orbotech's FPD AOI systems offer display manufacturers cutting edge automated inspection solutions for all types of display technologies including Flexible AMOLED. Orbotech FPD AOI systems increase production yields using advanced optics for image acquisition, unique image processing technologies, algorithms and data processing capabilities, microscopic video imaging, CD/Overlay measurements and automated macro (Mura) inspection to enable high-sensitivity defect detection and extremely accurate classification.

About Orbotech ArrayChecker

The Orbotech ArrayChecker test system determines whether individual pixels or lines of pixels are functional. It also finds more subtle process defects such as variations in individual pixel voltage. Defect data are used for repair and statistical process control to decrease material costs and improve throughput.

About Tianma Micro-electronics Co.

Tianma Micro-electronics Co. was founded in 1983 and is publicly traded on the Shenzhen Stock Exchange (SZ.000050) since 1995.  The company specializes in the design, manufacturing, and supply of high quality LCD and LCM products.  Affiliated companies within the Tianma Group, include Shenzhen Tianma, Shanghai Tianma, Shanghai AVIC, Chengdu Tianma, and Wuhan Tianma; combined to make up our state-of-the-art STN-LCD, CSTN-LCD, TFT-LCD, AMOLED, and CF production lines.

About Orbotech Ltd.

Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), LED, high speed RF on GaAs, power management device and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, click here

Share

Print


Suggested Items

SMTA Additive Electronics Conference: Industry Trends

10/10/2019 | I-Connect007
Mainstream PCB manufacturing is often limited to 50-75 microns (mm) line and space. But the electronics industry is evolving quickly. Propelled by the demand for more sophisticated electronics, PCB design is being tasked with finer lines, thinner materials, and smaller via sizes.

Additive Electronics Conference Set for October 2019

09/18/2019 | I-Connect007 Editorial Team
Tara Dunn, president of Omni PCB and I-Connect007 columnist, and Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Automotive, discuss what can be expected from the upcoming Additive Electronics Conference in San Jose, California, the impetus and motivation behind the conference, and who can benefit the most from attending.

Weaving Advocacy into E-Textiles

09/18/2019 | Kelly Scanlon, director, EHS policy and research
Electronic textiles (e-textiles) – fabrics that have electronics embedded in them to achieve certain functions – are of growing interest in the electronics manufacturing industry, and thus they are of growing interest to the IPC Government Relations team as well.



Copyright © 2019 I-Connect007. All rights reserved.