Elmatica Installs a Second Ucamco Integr8tor Workflow


Reading time ( words)

Elmatica recently installed a second Ucamco Integr8tor workflow. As a trusted partner in the medical, defense, automotive, automation, civil aviation, energy, and telecommunication industries, Elmatica keeps track of the entire purchasing process from consulting, designing, material selection, manufacturing selection, production monitoring, logistics and claims handling. 

Handling more than 12,000 RFQs per year, Ucamco’s Integr8tor enables Elmatica to work around the clock, receiving and analyzing their clients incoming design data and allowing to serve them better with more accurate, faster quotes than ever before. With over 45 years experience in the industry, Elmatica has a unique understanding of the market by procuring on four continents and delivering to five.

For more information about Ucamco, please click here

 

Share


Suggested Items

Innovating in the Technology of Stretchable PCBs

05/02/2017 | Pete Starkey, I-Connect007
Express Circuits is a long-established PCB fabricator located in Coleshill, near Birmingham in the Midlands of England, specialising in quick-turn complex prototype and small- to medium-volume microvia multilayer and rigid-flex. With the benefit of associate companies focused on design and assembly, Express is recognised for its exemplary customer service and technical support, as well as for its innovative manufacturing solutions.

American Standard Circuits Discusses e-Book on Designing Flex and Rigid-Flex

04/06/2017 | Patty Goldman, I-Connect007
American Standard Circuits is an industry leader when it comes to high-technology printed circuit boards, especially flex and rigid-flex printed circuit boards. So, it was natural that they would write about flex and rigid-flex for I-Connect007’s new “Guide to…” e-book series.

Vertical Conductive Structures–a New Dimension in High-Density Printed Circuit Interconnect

02/28/2017 | Pete Starkey, I-Connect007
From our previous conversations, I knew that Joan Tourné was working on a novel high-density interconnection concept. Having eagerly awaited the chance to discuss the technology in detail, I was delighted when he contacted me to confirm that his IP had been secured and that he could now talk openly about VeCS, the Vertical Conductive Structure designed to provide a cost-effective alternative for complex fan-out from fine-pitch grid array components.



Copyright © 2017 I-Connect007. All rights reserved.