Schweizer Presents Innovation at PCIM 2017


Reading time ( words)

The Schweizer p² Pack allowing to embed power electronics semiconductors into the printed circuit board (PCB) is a preferred solution for future high current motor drives. This embedding technology does not only save valuable installation space but offers further system advantages such as: improved conduction losses (RDSon) of the power electronics, improved thermal resistance and thermal impedance (RTH und ZTH) of the system, a low-inductive design, improved switching charcteristics, improved electromagnetic compatibility (EMC) as well as higher reliability.   

Schweizer Electronic AG now takes the next integration step by embedding shunts in combination with a half bridge for the first time. Thus the components‘thermal dissipation is optimised and further installation space can be saved, which is a considerable technical advantage in today’s trend towards miniaturisation. First demonstrators of this innovation will be shown at the Schweizer booth (hall 7, booth 240) on occasion of PCIM, taking place in Nuremberg from May 16 to 18, 2017.   

Many power electronics applications, e.g. motors, use shunts for current measurement. A shunt is a low-resistance precision resistor, applied for measuring electric currents. The current passing the shunt triggers a proportional voltage drop, which is measured. Shunts so far have usually been mounted on the PCB. As a consequence, the resulting heat has to be conducted through the substrate PCB first before reaching the cooling system.   

Technical details for embedded shunts Resistance values 0.05 up to 0.1 mΩ Currents: 0 - 300 A  Voltage drop: 0.5 – 30 mV Dissipation: 4.5 – 9 W Temperature rise: 3 – 5 K Contact resistance: < 1% of precision resistor.

About Schweizer

Schweizer Electronic AG stands for state-of-the-art technology and consultancy competence. Schweizer’s premium printed circuit boards and innovative solutions and services for automotive, solar, industry and aviation electronics address key challenges in the areas of Power Electronics, Embedding and System Cost Reduction. Its products are distinguished for their superior quality and their energy-saving and environmentallyfriendly features. Together with its partners WUS Printed Circuit (Kunshan) Co., Ltd., Meiko Electronics Co. Ltd. and Elekonta Marek GmbH & Co. KG the company offers in its division electronics cost- and productionoptimised solutions for small, medium and large series. Together with its partner Infineon Technologies AG, Schweizer plans to jointly tap the chip embedding market in future.

Share


Suggested Items

Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review

02/21/2018 | Pete Starkey, I-Connect007
The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.

EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

02/12/2018 | Pete Starkey, I-Connect007
Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!

The Benefits of Coming Together to Form a Global Reach

01/16/2018 | Patty Goldman, I-Connect007
At productronica, MacDermid Enthone Electronics Solutions and Alpha Assembly Solutions had one large combined booth to promote the companies’ integration. Over a buttered pretzel (don’t knock it until you’ve tried it), we talked about the newly amalgamated company, something everyone in the company is quite enthusiastic about.



Copyright © 2018 I-Connect007. All rights reserved.