Rogers Launches HeatSORB Thermal Management Material

Reading time ( words)

Rogers Corporation is pleased to announce the introduction of HeatSORB, a proprietary phase change material that addresses thermal management challenges in portable electronics. HeatSORB is a unique material capable of consistently absorbing large amounts of heat within a very specific temperature window.

Electronic components generate heat during the course of operation, raising the temperature of the device. HeatSORB captures that heat, allowing the device to remain cool in the user’s hand. This mechanism delays CPU temperature ramp and overall device temperature rise, resulting in improved user comfort and device efficiency. When the device is not in use, HeatSORB releases the thermal energy and regains its ability to absorb heat in the next cycle.

HeatSORB leverages an immobilized compound which requires a large amount of enthalpy to transition from one physical state to another. During that process, the material absorbs heat while preventing that heat from leaching into the electronics. The formulation is also designed for reliability, meaning HeatSORB remains effective throughout the life of the device, making overheating a thing of the past.

About Rogers Corporation

Rogers Corporation is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.


Suggested Items

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

Weiner’s World—August 2017

09/04/2017 | Gene Weiner, Weiner International Inc.
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.

Laser Patterning & Metallization to Reduce Process Steps for PCB Manufacturing

08/29/2017 | Joel Schrauben, Cameron Tribe, Christopher Ryder and Jan Kleinert, ELECTRO SCIENTIFIC INDUSTRIES
This paper details a new methodology for the plating of conductive features onto glass dielectrics. A laser is used to ablate material from a glass substrate in the desired pattern, and copper is “seeded” into these features using laser-induced forward transfer of a copper foil.

Copyright © 2018 I-Connect007. All rights reserved.