Orbotech Secures $24M Order From Flat Panel Display Manufacturer CHOT


Reading time ( words)

Orbotech Ltd. today announced a $24 million order with Xianyang CaiHong Optoelectronics Technology Co. Ltd., (CHOT), a Chinese flat panel display manufacturer and part of the China Electronics Corporation (CEC). The Orbotech solutions ordered are for phase I of CHOT’s new Gen 8.6 fab in Xianyang, China, and are designed to support the manufacture of a monthly capacity of 60,000 panels. The solutions chosen include multiple Automated Optical Inspection (AOI), Array Testing and Array Repair systems for use in the production of LCD TV displays.

“As the demand for LCD televisions grows, Orbotech continues to deliver advanced solutions that improve manufacturing process efficiencies and support the industry’s increasingly complex technologies,” stated Mr. Edu Meytal, President of Orbotech Pacific Display. “We are honored to have been chosen by CHOT and believe that our solutions, based on our proven experience and advanced technology, will help them to rise to the forefront of the world’s display technology leaders.”

Orbotech’s bookings for its FPD products are anticipated to reach, by the end of Q2 2017, approximately $300 million for the trailing 12 months.

“We are very pleased with the intensified demand for our innovative display solutions, particularly over the trailing 12 months,” said Gil Oron, Corporate Vice President and President of the FPD Division. “This increased demand for Orbotech’s LCD and OLED solutions is testament to the advanced technology of our solutions and the close cooperation with our customers which enable us to develop accurate, reliable solutions for their current and future needs.”

About FPD Automated Optical Inspection (AOI)

Orbotech’s Quantum™ FPD AOI system offers display manufacturers cutting edge automated inspection solutions for all types of display technologies including Flex and OLED. Orbotech FPD AOI systems increase production yields using advanced optics for image acquisition, unique image processing technologies, algorithms and data processing capabilities, microscopic video imaging, CD/Overlay measurements and automated macro (Mura) inspection to enable high-sensitivity defect detection and extremely accurate classification.

Share

Print


Suggested Items

Vertical Conductive Structures, Part 3: Design Tool Techniques

08/23/2019 | Ed Hickey and Mike Catrambone, Cadence Design Systems, and Joan Tourné, Nextgin Technology
New vertical conductive structure (VeCS) technology can reduce layer count and improve signal integrity without the need for sequential technologies. VeCS is different than traditional through-hole vias, microvias, and ELIC designs, which are more expensive and require a high number of laminations, drilling, and plating cycles to build up a reasonable number of layers.

Nano Dimension Details New DragonFly LDM

08/21/2019 | Dan Feinberg, Technology Editor, I-Connect007
Dan Feinberg talks with Nano Dimension CEO Amit Dror about the new DragonFly LDM 3D printer technology announced by the Israeli company on July 24, 2019, aimed at increasing machine uptime and moving forward from prototyping to higher production volumes.

Dissecting the IPC Regional Survey on PCB Technology Trends

07/15/2019 | I-Connect007 Editorial Team
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.



Copyright © 2019 I-Connect007. All rights reserved.