Four TUC FR-4 Materials Now Listed Under UL


Reading time ( words)

George Hsin, chief strategy officer of Taiwan Union Technology Corp. (TUC), has announced that the company now has four products listed as FR-15.1 in their UL file.

FR-15 listed products are FR-4 base materials that have tested to have 150°C electrical and mechanical relative thermal indices (RTI). The electrical and mechanical RTI is determined by the Long Term Thermal Aging program by UL. Recently UL has established a new definition FR-4 which extends the maximum operating temperature (MOT) from 130°C to 150°C.

TUC’s four products listed as FR-15.1 includes the TU-862 HF FR-15, TU-865 FR-15, the TU-862T FR-15, and the TU-863+ FR-15 (Thunderclad 1). These FR-4 type products all can be used in boards operating between 130°C and 150°C.

About TUC

TUC is a leading global developer and manufacturer of prepregs and laminates for the electronics industry. We provide materials that deliver solutions for present and future designs by partnering with our customers, as well as market-leading OEMs. We are committed to innovation and leading technologies while maintaining product manufacturability and unparalleled service and support. We provide superior global technical resources and a competitive edge to equip customers with solutions that generate extraordinary value. For more information, visit www.tuc.com.tw/.

Share


Suggested Items

35 Years of HDI Fabrication Processes and Obstacles for Implementation

12/04/2017 | Happy Holden, I-Connect007
The electronics industry is the world’s largest and most robust market. It is also a bulwark of American creativity, with Silicon Valley as its origin and fortress.

HDI’s Beneficial Influence on High-Frequency Signal Integrity

10/17/2017 | Happy Holden, I-Connect007
The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs).

Embedding Active and Passive Components in Organic PCBs for More Reliability and Miniaturization

06/20/2017 | Thomas Hofmann, HOFMANN LEITERPLATTEN GMBH
Hofmann Leiterplatten GmbH has developed a wide range of products in the last 25 years. New manufacturing know-how has been developed in fabricating organic PCB with embedded devices. A special name, AML (active multilayer), was created to differentiate the surface mount devices (SMD) and the device embedded technology (DET) PCBs. Manufacturing processes that are not typical for standard PCB fabrication shops has been developed.



Copyright © 2017 I-Connect007. All rights reserved.