Ventec International Expands UK Clean-Room Manufacturing Capacity


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Ventec International Group, a world leader in the production of polyimide and high reliability epoxy laminates and prepregs, is upgrading the fabrication capability and capacity at its United Kingdom facility with an investment into new state-of-the-art equipment for copper foil cutting in a Class 10,000 (ISO 7) clean-room environment.

To capture growth opportunities in the high-end, high-performance markets, which are driven by particular demand from high reliability automotive, military and aerospace applications, Ventec is investing in additional equipment to increase capacity to deliver medium volume copper foil cutting capability in its Class 10,000 (ISO 7) clean-room facility in Leamington Spa. The new facility is planned to be operational during July 2017.

Adding additional copper foil cutting capacity in the UK offers customers a unique advantage through fast delivery of cut-to-size copper foils from CCP for processing with Ventec's range of copper clad laminates and prepregs.

Mark Goodwin, COO Europe & USA, commented, "Ventec's phased and strategic investment plan across our global network of service centers is continuing throughout 2017, enabling us to offer our customers one single quick-turn access point to an extraordinary portfolio of laminates & prepregs and complementary consumable products & services. All Ventec's facilities are designed to meet the strictest clean room standards, and the UK is no exception."

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry.

Further information about Ventec's solutions and the company's wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec App.

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