Ventec International Expands UK Clean-Room Manufacturing Capacity


Reading time ( words)

Ventec International Group, a world leader in the production of polyimide and high reliability epoxy laminates and prepregs, is upgrading the fabrication capability and capacity at its United Kingdom facility with an investment into new state-of-the-art equipment for copper foil cutting in a Class 10,000 (ISO 7) clean-room environment.

To capture growth opportunities in the high-end, high-performance markets, which are driven by particular demand from high reliability automotive, military and aerospace applications, Ventec is investing in additional equipment to increase capacity to deliver medium volume copper foil cutting capability in its Class 10,000 (ISO 7) clean-room facility in Leamington Spa. The new facility is planned to be operational during July 2017.

Adding additional copper foil cutting capacity in the UK offers customers a unique advantage through fast delivery of cut-to-size copper foils from CCP for processing with Ventec's range of copper clad laminates and prepregs.

Mark Goodwin, COO Europe & USA, commented, "Ventec's phased and strategic investment plan across our global network of service centers is continuing throughout 2017, enabling us to offer our customers one single quick-turn access point to an extraordinary portfolio of laminates & prepregs and complementary consumable products & services. All Ventec's facilities are designed to meet the strictest clean room standards, and the UK is no exception."

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry.

Further information about Ventec's solutions and the company's wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec App.

Share




Suggested Items

ICT Seminar 2023 Review: Energy, Thermals, and Assistive Technology

03/16/2023 | Pete Starkey, I-Connect007
Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.

EIPC Winter Conference 2023, Day 2 Review

02/28/2023 | Pete Starkey, I-Connect007
Day 2 of the EIPC Winter Conference at the Groupama Stadium in the Décines-Charpieu region of the Metropolis of Lyon in eastern France included a privileged visit to the Bugey Nuclear Power Plant for those who were registered and passed their security clearance. Such was the interest that the party was split into morning and afternoon groups. EIPC board member Martyn Gaudion, CEO of Polar Instruments, made a fine job of moderating Session 6 twice over.

EIPC Winter Conference 2023: Day 1 Review

02/27/2023 | Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.