Amphenol Invotec Invests in Dynachem Lamination Technology


Reading time ( words)

Amphenol Invotec has installed a state-of-the-art Dynachem inner-layer dry film lamination line capable of handling 25 micron cores.

“This equipment line forms part of a £1.5 million investment and will ensure that we are suitably placed to meet the demands of our markets over the coming years. By making this commitment not only are we improving our process capabilities but implementing the latest in dry film lamination technology.” said Tim Tatton, general manager of Amphenol Invotec.

“After comprehensive benchmarking against other leading lamination system manufacturers, the Dynachem solution was chosen as the stand-out choice; a proven and robust system for laminating fine line circuitry. Dynachem are an established supply partner and delivered exceptional after sales and service support,” said Steve Kerr, process engineering manager of Amphenol Invotec.

Osvaldo Novello, managing director of Dynachem, said, “We are extremely pleased to have been chosen by Amphenol Invotec once again. We have been actively implementing and improving our technology to meet the growing needs of the PCB industry. We have invested heavily in research and development and it is nice to see it well received in the industry.”

About Amphenol Invotec 

Operating from facilities in Tamworth and Telford, Amphenol Invotec is one of Europe’s leading manufacturers of time critical, high technology printed circuit boards.

The company manufactures a wide range of multilayer, HDI, sequential lamination, flex and rigid-flex PCBs using a variety of advanced materials, finishes and technologies to meet exacting customer specifications. For more information visit www.amphenol-invotec.com.

Share


Suggested Items

RTW CPCA Show: AWP Discusses Whelen Engineering Project Success

06/06/2018 | Real Time with...CPCA
At the recent CPCA Show 2018 in Shanghai, Jochen Zeller, vice president of AWP Group, speaks about the challenges impacting the wet processing part of the PCB manufacturing industry, such as the continuing miniaturization trend leading to finer widths and line spacings, as well as traceability.

CFX: Updates and Developments

02/05/2018 | Stephen Las Marias, I-Connect007
In an interview with I-Connect007, she discusses the latest developments in the Connected Factory Initiative (CFX), the machine data interface standard that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits, and CFX demos at IPC APEX EXPO 2018.

The Significance of the PCB in the Value Chain of the European EMS Industry

06/27/2017 | Pete Starkey, I-Connect007
At SMT Nuremberg, Pete Starkey meets with Dieter Weiss, who comments upon the significance of the PCB in the value chain of the European EMS industry, and looks to a future where we embrace an open-minded attitude and a willingness to work together.



Copyright © 2018 I-Connect007. All rights reserved.