Shengyi Technology Obtains UL Listing for FR-4 Grade S1190M


Reading time ( words)

Shengyi Technology Company Ltd. is pleased to announce that their FR-4 product, S1190M, has been listed by UL with an electrical and mechanical Relative Thermal Index (RTI) of 150°C. Recently UL changed the definition of FR-4 to allow already listed FR-4.0 and FR-4.1 to be used in PWBs operating up to 150°C if the Long Term Thermal Aging (LTTA) data passed the electrical and mechanical requirements.  

Shengyi is the first base material supplier world-wide to have a FR-15.0 product listed with an electrical and mechanical Relative Thermal Index (RTI) of 150°C. That product, S1190M, is a brominated epoxy system with a Tg of 200°C and a Td of 355°C designed for lead-free processing. S1170G was the first halogen-free product to be listed as FR-15.1 with a Tg and Td of 180°C and 390°C respectively. Both products exhibit high thermal reliability and excellent CAF resistance which allows them to be used for communication, computer and automotive applications.

S1190M products are listed in Shengyi’s UL File # E109769 as an ANSI Grade FR-15.0. FR-15.0 indicates that it is a brominated FR-4 product with an RTI of 150°C.

Board designers can feel more comfortable knowing that S1190M can be used at higher temperatures than for traditional FR-4s. Other current FR-4 products will also be listed as FR-15 in the Shengyi UL file as customer requirements dictate.

About Shengyi Technology Company Ltd.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates and prepregs. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials. Shengyi maintains a state-of-the-art manufacturing facility in Dongguan where it manufactures FR4, CEM-1, CEM-3 and a variety of prepregs. In addition, the company maintains laminate and prepreg manufacturing operations in Suzhou, Shaanxi and Changshu. Shengyi’s products are used in single-sided, double-sided and multilayer printed circuit boards and the company’s global customer base spans a broad spectrum of markets including mobile phones, automotive, telecommunication equipment, computers and higher-level electrical products. More information about the company is available here 

Share


Suggested Items

EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1

07/09/2018 | Pete Starkey, I-Connect007
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.

EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 2

07/04/2018 | Pete Starkey, I-Connect007
Part 2 of I-Connect007 Technical Editor Pete Starkey's article on the recent EIPC 50th Anniversary Conference in Dusseldorf, Germany, continues with recap of technical presentations by Emma Hudson, Shannon Juan, Alex Ippich, and Russell Morgan. Read on.

PCB Material Toolbox for Today’s 3G and 4G Networks and Future High-Speed Needs in 5G

06/27/2018 | Stig Källman, ERICSSON with Happy Holden, I-CONNECT007
The material toolbox idea first came up when I saw the IPC appendix list for standard 1-ply stack-ups. The idea is to make a very simple bill of materials, specifications and notes, and possibly use the same prepreg/resin in the laminate and in the core.



Copyright © 2018 I-Connect007. All rights reserved.