Shengyi Technology Obtains UL Listing for FR-4 Grade S1190M


Reading time ( words)

Shengyi Technology Company Ltd. is pleased to announce that their FR-4 product, S1190M, has been listed by UL with an electrical and mechanical Relative Thermal Index (RTI) of 150°C. Recently UL changed the definition of FR-4 to allow already listed FR-4.0 and FR-4.1 to be used in PWBs operating up to 150°C if the Long Term Thermal Aging (LTTA) data passed the electrical and mechanical requirements.  

Shengyi is the first base material supplier world-wide to have a FR-15.0 product listed with an electrical and mechanical Relative Thermal Index (RTI) of 150°C. That product, S1190M, is a brominated epoxy system with a Tg of 200°C and a Td of 355°C designed for lead-free processing. S1170G was the first halogen-free product to be listed as FR-15.1 with a Tg and Td of 180°C and 390°C respectively. Both products exhibit high thermal reliability and excellent CAF resistance which allows them to be used for communication, computer and automotive applications.

S1190M products are listed in Shengyi’s UL File # E109769 as an ANSI Grade FR-15.0. FR-15.0 indicates that it is a brominated FR-4 product with an RTI of 150°C.

Board designers can feel more comfortable knowing that S1190M can be used at higher temperatures than for traditional FR-4s. Other current FR-4 products will also be listed as FR-15 in the Shengyi UL file as customer requirements dictate.

About Shengyi Technology Company Ltd.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates and prepregs. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials. Shengyi maintains a state-of-the-art manufacturing facility in Dongguan where it manufactures FR4, CEM-1, CEM-3 and a variety of prepregs. In addition, the company maintains laminate and prepreg manufacturing operations in Suzhou, Shaanxi and Changshu. Shengyi’s products are used in single-sided, double-sided and multilayer printed circuit boards and the company’s global customer base spans a broad spectrum of markets including mobile phones, automotive, telecommunication equipment, computers and higher-level electrical products. More information about the company is available here 

Share




Suggested Items

A Promising Future for Automation

03/21/2023 | Christopher Bonsell, Chemcut
This year, I had the great opportunity to come to IPC APEX EXPO in San Diego as a contributing member in Chemcut’s booth. Being an exhibitor is always interesting because you never know what you will learn or who you will meet. Truly, it seems that every IPC APEX EXPO is an eye-opening experience. This was the second show I attended, and last year I was amazed to see how in-depth and interconnected the electronics industry is. Seeing how many different companies contribute to manufacturing today’s core technology never fails to impress me.

IPC APEX EXPO 2023 Special Session: Advanced Packaging

03/13/2023 | Pete Starkey, I-Connect007
The IPC APEX EXPO Special Session on Advanced Packaging this year attracted enormous interest, with Conference Room 2 at capacity long before the session began. Even with lots of extra seats squeezed around the edges, the session was standing room only for the just-in-time arrivals. IPC Chief Technology Officer Matt Kelly opened proceedings by introducing a distinguished panel of experts: Jan Vardaman, president and founder of TechSearch International; Sam Salama, CEO of Hyperion Technology; Matt Neely, director of process engineering at TTM Technologies; and Jim Fuller, VP of engineering technology at Sanmina.

EIPC Winter Conference 2023: Day 1 Review

02/27/2023 | Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.