Rogers to Host Investor Day August 17


Reading time ( words)

Rogers Corporation plans to host an investor day the morning of August 17 at the New York Stock Exchange. The company will discuss its business, strategy, technology leadership, segments, and provide investors a financial overview.

For entry into the New York Stock Exchange, pre-registration is required by July 31 with Rogers Corporation, by emailing your name, title, company affiliation, and expected arrival time to investor.relations@rogerscorporation.com. The investor day will also be accessible via live webcast.

Continental breakfast will be available beginning at 8am ET on August 17, with company presentations beginning at 9am. Registration confirmations and logistical details for entry into the New York Stock Exchange will be provided at later dates to individual attendees.

For questions, comments or concerns, please contact Jack Monti, Rogers’ Head of Investor Relations, via email or telephone at the contact information below. We look forward to hosting you in New York.

About Rogers Corporation

Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, e-Mobility and renewable energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.

or additional information, please click here.

Share

Print


Suggested Items

Industry Set for Shift to True 3D Printing and Photonics

12/09/2019 | Nolan Johnson, PCB007
Nolan Johnson sits down with Zach Peterson, owner of Northwest Engineering Solutions, who predicts two things that would challenge the current status quo for the PCB manufacturing industry: true 3D printing and additive, including discretes as well as the substrates and traces, and a completely different approach with photonics.

TTM to Exhibit at SAE WCX 2019

03/21/2019 | Globe Newswire
TTM Technologies, Inc. will be exhibiting at the Society of Automotive Engineers World Congress Experience 2019 (SAE WCX), booth 2234.

Atotech at HKPCA on Announcements and Advancements

01/21/2019 | Edy Yu, I-Connect007
Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.



Copyright © 2020 I-Connect007. All rights reserved.