N.A. Flex Market to Witness Significant Growth


Reading time ( words)

Research and Markets has announced the addition of the "North America Flexible Printed Circuit Boards Market (2016-2022)" report to their offering.

Flexible PCBs are highly efficient interconnectivity solutions which are widely used in a range of electronic devices with complex circuitry. The flexible printed circuit boards are traces of conductive material on a flexible substrate which are used to simplify the wiring and other connections. Flexible PCBs are also use to efficiently interconnect electronic components such as integrated circuits, capacitors, and resistors.

The flexible printed circuit boards (FPCBs) market would witness significant growth during the forecast period. Flexible PCBs are designed to overcome limitations of rigid PCBs and manual wiring. Printed circuit boards (PCBs) were initially used in the industrial systems, especially for data transmission. Nevertheless, other industries such as consumer electronics, energy & power, inverter & UPS, and automotive, have also initiated the adoption of FPCBs to efficiently manage data transfer.

The development of innovative products for applications, especially in telecommunication and electronic appliances would be a market strategy among the leading players. FPCB enables high-frequency data transfer which significantly improves the efficiency and also prevents power loss. Low power consumption and intense competition in the business landscape have led the industries to adopt multilayer FPCBs, stimulating market growth.

The U.S. remained the dominant country in the North America flexible printed circuit board market in 2015. Canada would witness promising CAGR during the forecast period (2016-2022).

Share




Suggested Items

PCB Technologies’ InPack to Focus on Miniaturization, Packaging

05/16/2022 | Andy Shaughnessy, Design007 Magazine
I recently spoke with PCB Technologies’ Jeff De Serrano, Yaniv Maydar, and Alon Menache about their new venture, InPack. They explain their plans to focus on advanced packaging, miniaturization, and other high-end technology, with much faster time to market, and they offer a view of the global market as well.

EIPC Technical Snapshot: Supporting Autonomous Driving

05/12/2022 | Pete Starkey, I-Connect007
EIPC’s 17th Technical Snapshot webinar on May 4 focused on developments in automotive electronics, particularly on advances in the technologies required to support the evolution of autonomous driving. The team brought together two expert speakers to present their detailed views on topics encompassed within “CASE,” the acronym that appears to be taking over the automotive industry.

EIPC Technical Snapshot: High-end PCB Market Requirements and Technology Trends

03/30/2022 | Pete Starkey, I-Connect007
The European Institute for the PCB Community (EIPC) continues to provide an efficient platform for following and pursuing new developments. Its Technical Snapshot webinar has become established as a must-attend monthly event, and consistently delivers essential information of the highest calibre and relevance. The 16th in the series on March 23 focused on market requirements and technology trends at the high end of the PCB and semiconductor packaging industries, with two eminent speakers.



Copyright © 2022 I-Connect007. All rights reserved.