Embedding Components, Part 1


Reading time ( words)

The printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces. Companies attempting to improve functionality and minimize space are now considering embedding a broad range of these components within the circuit structure. Both uncased active and passive component elements are candidates for embedding but the decision to embed components within the multilayer circuit structure must be made early in the design process.

Some components are easy candidates for integrating into the substrate while others may involve more complex processes and will be difficult to rationalize. Processes have evolved for embedding and interconnecting a range of common passive components: resistor, capacitor and inductor elements. Embedding formed resistor elements, however, is the most mature and economical process to implement. A formed resistor will have two copper lands with resistance material applied between the lands.

The shape of the resistance material can be a simple rectangle, or a shape designed to maximize resistor element length while minimizing area. In each case, the resistance material must overlap the copper lands.

Formed resistor elements may be furnished as a printed thick-film composition or by employing a chemically etched thin-film process.

- Thick-film resistor materials are formulated to furnish a wide range of primary values. The resistor formulations are based on carbon-filled epoxy chemistry that enables screen printing the elements directly onto pre-patterned terminations on a designated circuit board layer followed by curing the product at temperatures in the range of 150°C. This carbon-filled epoxy thick film (TF) chemistry has been successfully used for a broad number of commercial applications. The process is generally employed where tolerances are less critical. Applications are varied and range from simple discrete potentiometers to pull-up and pull-down resistors.

To read the full version of this article which appeared in the June 2017 issue of The PCB Magazine, click here.

Share


Suggested Items

Walt Custer’s Annual Update from productronica 2017

11/21/2017 | Patty Goldman, I-Connect007
Industry consultant Walt Custer of Custer Consulting sat down with me at productronica 2017 to once again inform our readers with his yearly update and perspective on what’s happening in the industry. And guess what? It’s good news! Pertinent charts referenced in our conversation are included, but if you want more, Walt invites you to click the link at the end of this conversation and email him directly.

New I-Connect007 Team Members Tour American Standard Circuits

11/06/2017 | Kiersten Rohde and Jonathan Zinski, I-Connect007
Recently, Anaya Vardya, CEO of American Standard Circuits, invited two of I-Connect007’s newest team members, IT coordinator Jonathan Zinski and Editor Kiersten Rohde, to tour his facility in West Chicago, Illinois. Happy Holden, resident PCB expert, also joined the newbies on their field trip to ASC. In the following articles, Jonathan and Kiersten describe their experience touring ASC. Special thanks to Anaya for hosting the I-Connect007 team.

Catching up with…Brigitflex

11/02/2017 | Dan Beaulieu
Today, Brigitflex is building unique custom-made boards for companies all over the world, from large defense and aerospace companies to small incubator companies inventing new products. They have become well-known as the shop to go to when nobody else can solve your problems.



Copyright © 2017 I-Connect007. All rights reserved.