Reading time ( words)
The European Institute for the PCB Community (EIPC) is inviting the industry to submit technical papers for presentation at the upcoming Winter Conference Lyon 2018, which will be held on February 1–2, 2018 at Alstom France.
Papers are being sought for the following topics:
- Future Trends
- Reliability by Application
- Tools for Reliability
- Design & New Technologies
- The Technology Roadmap for the Electronics Industry
The deadline for submission of abstract is August 7.
For more information, click here.
Pete Starkey, I-Connect007
Just like old times—meeting with John Ling, with whom I had previously travelled to industry events for over two decades, and who still carries the role of EIPC marketing manager, to fly together from Birmingham UK to Dusseldorf in Germany for the EIPC 50th Anniversary Summer Conference.
Jan Pedersen, ELMATICA
Driving a car is probably one of the areas where the user comes in direct touch with the technology development. And we understand the speed when we see how fast we get new versions of smartphones and other gadgets. But in what direction are we going?
Dan Feinberg, Technology Editor, I-Connect007
Now on its ninth year, the Augmented World Expo (AWE USA) is perhaps the largest event for professionals focused on providing science fiction-like abilities through XR (cross reality) and associated wearable technology. This year’s event showcased over 100,000 square feet of exhibit space and featured numerous presentations and discussions covering topics ranging from the latest and greatest uses and devices for XR to the business of marketing and monetizing it.