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The European Institute for the PCB Community (EIPC) is inviting the industry to submit technical papers for presentation at the upcoming Winter Conference Lyon 2018, which will be held on February 1–2, 2018 at Alstom France.
Papers are being sought for the following topics:
- Future Trends
- Reliability by Application
- Tools for Reliability
- Design & New Technologies
- The Technology Roadmap for the Electronics Industry
The deadline for submission of abstract is August 7.
For more information, click here.