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The European Institute for the PCB Community (EIPC) is inviting the industry to submit technical papers for presentation at the upcoming Winter Conference Lyon 2018, which will be held on February 1–2, 2018 at Alstom France.
Papers are being sought for the following topics:
- Future Trends
- Reliability by Application
- Tools for Reliability
- Design & New Technologies
- The Technology Roadmap for the Electronics Industry
The deadline for submission of abstract is August 7.
For more information, click here.
Patty Goldman, I-Connect007
IPC President and CEO John Mitchell gave I-Connect007 a sneak-peek at the upcoming IPC APEX EXPO, happening in February in San Diego. Mitchell provides a description of this year’s keynote, as well as a few new additions and areas of emphasis. It looks like it will be another packed house, with plenty to see, do, and learn about.
Dan Feinberg, FeinLine Associates, Inc.
Two disruptive technologies that we have been covering for the last few years are 3D printing—especially as it pertains to PCB fab—and autonomous driving. 3D printing has been around for a few years, but it seems like 3D printers were introduced to CES very recently. This year there were almost 50 exhibitors showing their latest offerings. Most of them were in the LVCC in the north hall at the 3D Printing Marketplace.
Barry Matties, I-Connect007
Peter Brandt, atg’s director of sales for Europe, India and Japan, joined Barry Matties at productronica to share his views on regional variations in electrical testing requirements, automation, traceability, and how to anticipate and satisfy the future demands of the market. Group general manager Dr. Jochen Kleinertz also comments on the need for close cooperation with customers to guide the R&D effort.