Reading time ( words)
The European Institute for the PCB Community (EIPC) is inviting the industry to submit technical papers for presentation at the upcoming Winter Conference Lyon 2018, which will be held on February 1–2, 2018 at Alstom France.
Papers are being sought for the following topics:
- Future Trends
- Reliability by Application
- Tools for Reliability
- Design & New Technologies
- The Technology Roadmap for the Electronics Industry
The deadline for submission of abstract is August 7.
For more information, click here.
Patty Goldman, I-Connect007
Industry consultant Walt Custer of Custer Consulting sat down with me at productronica 2017 to once again inform our readers with his yearly update and perspective on what’s happening in the industry. And guess what? It’s good news! Pertinent charts referenced in our conversation are included, but if you want more, Walt invites you to click the link at the end of this conversation and email him directly.
Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, and Kenneth Church nSCRYPT INC.
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll-to-roll processes.
Pete Starkey, I-Connect007
This year’s event had a well-chosen and varied programme featuring presentations on process chemistry and R&D consortia, a discussion of controversial standards proposals and a review of the experiences of commissioning new technology in a start-up factory.