EIPC SpeedNews: News from the European PCB Industry


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News from Austria

- AT&S Paves the Way for Autonomous Driving and High-speed Communication

News from Germany

- Unimicron will Rebuild the Inner-layer Plant

- Schweizer Electronic AG's Annual Shareholders' Meeting

- Change of Ownership at Hausermann GmbH in Gars am Kamp

News from Switzerland

- Standards: IEC 61191-3:2017

News from the UK

- Eurocircuits Tips & Tricks - Cost-Effective Solder Paste Printing

Electronic Industry News

- BondFilm LDD MSAP – Atotech's Laser Direct Drilling Pretreatment for Advanced MSAP Applications

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 21

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Video from productronica 2017: Taiyo America Highlights Ink-Jettable Solder Mask

11/17/2017 | I-Connect007
After a long-term program of cooperative development, evaluation and qualification, Taiyo America’s solvent-free ink-jet solder mask formulation is working successfully in a technically demanding production environment. Don Monn recounts his experiences from the show floor at productronica 2017.

The PCB Norsemen: Industry 4.0, AI and CircuitData

11/14/2017 | Andreas Lydersen, ELMATICA
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Groundbreaking Developments at liloTree

11/09/2017 | Patty Goldman, I-Connect007
I was introduced to liloTree and Chief Scientist Kunal Shah by Joe Fjelstad. It seems this small company (with Intel as part of its pedigree) has developed a novel ENIG process that just may shake up the regular chemistry suppliers. This new process is described as cost-effective and ecofriendly while completely eliminating black pad and brittle solder joints.



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