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The European Institute for the PCB Community (EIPC) is extending the deadline for the submission of abstracts for paper presentation at the Winter Conference Lyon 2018, which will be held on February 1–2, 2018 in Alstom, France.
Abstract submission should be no later than September 10.
Click here for the detailed call for papers.
Click here for the abstract submission form.
Click here for the conference registration form
Minsu (Tim) Lee is the secretariat of the ECWC 14 Worldwide Printed Circuit Conference, which recently concluded in Seoul, South Korea. Tim is also the program manager of the Korean Printed Circuit Association. We had a few minutes together after the conference ended to review the week’s events and the Korean PCB industry. Tim also focused on the ongoing situation with North Korea, which resulted in many Chinese paper contributors being denied visas for ECWC 14.
Pete Starkey, I-Connect007
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
Alun Morgan, European Institute of Printed Circuits
The Premier Inn conference centre at Heathrow Airport was the venue for the EIPC workshop on PCB BioMEMS. What, I hear you ask, is a PCB BioMEMS? This is an abbreviation for biomedical (or biological) microelectromechanical systems, otherwise known as lab-on-chip.