EIPC SpeedNews: News from the European PCB Industry


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News from the EIPC

- Extended Deadline: September 10 – Call for Papers for EIPC Winter Conference Lyon, France, February 1–2

News from Austria

- First Quarter of 2017/18: AT&S Starts the Financial Year with Significant Revenue Growth and Improved Earnings

Electronic Industry News

- The "New" High Cost of Doing Business in China
- "Alexa, Understand Me"
- Battery-free Mobile Phone Nears Reality

News from the UK
- Spirit Circuits Open their Factory in Romania – BATM Systems

Click here for the International Events Diary 2017

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Groundbreaking Developments at liloTree

11/09/2017 | Patty Goldman, I-Connect007
I was introduced to liloTree and Chief Scientist Kunal Shah by Joe Fjelstad. It seems this small company (with Intel as part of its pedigree) has developed a novel ENIG process that just may shake up the regular chemistry suppliers. This new process is described as cost-effective and ecofriendly while completely eliminating black pad and brittle solder joints.

New I-Connect007 Team Members Tour American Standard Circuits

11/06/2017 | Kiersten Rohde and Jonathan Zinski, I-Connect007
Recently, Anaya Vardya, CEO of American Standard Circuits, invited two of I-Connect007’s newest team members, IT coordinator Jonathan Zinski and Editor Kiersten Rohde, to tour his facility in West Chicago, Illinois. Happy Holden, resident PCB expert, also joined the newbies on their field trip to ASC. In the following articles, Jonathan and Kiersten describe their experience touring ASC. Special thanks to Anaya for hosting the I-Connect007 team.

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07/11/2017 | Patty Goldman, I-Connect007
I went to my second IMPACT Washington, D.C. event this year (May 1–3) and, as much as I applauded last year’s event, this one far surpassed it—just ask anyone who was there. In this month’s issue, a special section on IMPACT backs that claim.



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