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This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
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In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
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Conductor Analysis Technologies (CAT) Installs OM Thermal Stress Systems at TTM-Sterling
September 6, 2017 | Conductor Analysis TechnologiesEstimated reading time: Less than a minute
Conductor Analysis Technologies announces the installation and operation of two OM Thermal Stress Systems at TTM’s Sterling, Virginia manufacturing facility.
Tim Estes, CAT Chief Technology Officer, and Nick Meeker, CAT Chief Operating Officer, were personally at the Sterling site to oversee the installation and provided training. The systems perform both convection reflow assembly simulation of the recently released IPC-TM-650, Method 2.7.27A and air-to-air thermal cycling of IPCTM-650, Method 2.6.7.2.
About Conductor Analysis Technologies, Inc.
Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by designers, purchasers, assemblers, and manufacturers of printed circuit boards. Founded in 1994, our products and services provide a standardized, independent, and documented evaluation of printed manufacturing capability, quality, and reliability. For more information, click here.
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