Conductor Analysis Technologies (CAT) Installs OM Thermal Stress Systems at TTM-Sterling


Reading time ( words)

Conductor Analysis Technologies announces the installation and operation of two OM Thermal Stress Systems at TTM’s Sterling, Virginia manufacturing facility.  

Tim Estes, CAT Chief Technology Officer, and Nick Meeker, CAT Chief Operating Officer, were personally at the Sterling site to oversee the installation and provided training.  The systems perform both convection reflow assembly simulation of the recently released IPC-TM-650, Method 2.7.27A and air-to-air thermal cycling of IPCTM-650, Method 2.6.7.2.

About Conductor Analysis Technologies, Inc.

Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by  designers, purchasers, assemblers, and manufacturers of printed circuit boards.  Founded in 1994, our products and services provide a standardized, independent, and documented evaluation of printed manufacturing capability, quality, and reliability. For more information, click here

Share




Suggested Items

Understanding the UHDI Market

11/28/2022 | I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/14/2022 | Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/07/2022 | Andy Shaughnessy, Design007 Magazine
It’s been a busy week for I-Connect007. Managing Editor Nolan Johnson and I covered PCB West at the Santa Clara Convention Center, and, as you’ll see in my article below the place was packed. We have an article about SMTA International, scheduled for the end of October. I think the trade show season is looking good into 2023. People are done with COVID shutdowns and ready to get back to live trade shows and conferences. We’ll be in Minneapolis to bring you the latest news and technical information. We also have a news report about the European Union committing to craft its own version of America’s CHIPS Act. There’s a great interview with Dana Korf and John Strubbe about the latest innovations in materials at TUC. And columnist Paige Fiet explains why she is committed to making manufacturing “cool” again to help recruit and retain young technologists.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.