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Conductor Analysis Technologies announces the installation and operation of two OM Thermal Stress Systems at TTM’s Sterling, Virginia manufacturing facility.
Tim Estes, CAT Chief Technology Oﬃcer, and Nick Meeker, CAT Chief Operating Oﬃcer, were personally at the Sterling site to oversee the installation and provided training. The systems perform both convection reﬂow assembly simulation of the recently released IPC-TM-650, Method 2.7.27A and air-to-air thermal cycling of IPCTM-650, Method 184.108.40.206.
About Conductor Analysis Technologies, Inc.
Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by designers, purchasers, assemblers, and manufacturers of printed circuit boards. Founded in 1994, our products and services provide a standardized, independent, and documented evaluation of printed manufacturing capability, quality, and reliability. For more information, click here.
Dan Feinberg, Technology Editor, I-Connect007
I-Connect007 Technical Editor Dan Feinberg accepted an invitation recently to tour Nano Dimension’s new USA headquarters in Santa Clara’s Silicon Valley, which included a sit-down with President and Co-Founder Simon Fried.
Patty Goldman, I-Connect007
If you’re like me, you’ve probably heard of 5G, but you may not understand what all the fuss is about. First, 5G simply means fifth-generation mobile networks. The best way to understand what 5G is about is to understand all the other Gs, like 3G and 4G (we rarely hear about the early Gs!).
Stephen Las Marias, I-Connect007
At the recent HKPCA and IPC Show 2017 in Shenzhen, China, I was able to interview Les Sainsbury, CEO, and Andrew Kelley, CTO, of XACT PCB, as well as Alex Stepinski, vice president of Whelen Engineering’s PCB Fab Business Unit, to discuss process evolution and technology developments in the PCB manufacturing industry.