Conductor Analysis Technologies (CAT) Installs OM Thermal Stress Systems at TTM-Sterling

Reading time ( words)

Conductor Analysis Technologies announces the installation and operation of two OM Thermal Stress Systems at TTM’s Sterling, Virginia manufacturing facility.  

Tim Estes, CAT Chief Technology Officer, and Nick Meeker, CAT Chief Operating Officer, were personally at the Sterling site to oversee the installation and provided training.  The systems perform both convection reflow assembly simulation of the recently released IPC-TM-650, Method 2.7.27A and air-to-air thermal cycling of IPCTM-650, Method

About Conductor Analysis Technologies, Inc.

Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by  designers, purchasers, assemblers, and manufacturers of printed circuit boards.  Founded in 1994, our products and services provide a standardized, independent, and documented evaluation of printed manufacturing capability, quality, and reliability. For more information, click here


Suggested Items

RTW IPC APEX EXPO: IPC—Industry Trends Moving Forward

03/20/2018 | Real Time with...IPC
Sharon Starr, director of market research for the IPC, discusses industry trends moving forward covering both EMS and PCB. She also mentions the upcoming studies IPC will be conducting in 2018.

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

A Plug-in that Connects CAD Software to 3D Printer

03/13/2018 | Dan Feinberg
Nano Dimension's DragonFly 2020 Pro 3D Printer is a highly accurate and versatile inkjet deposition and curing system for printing professional multilayer circuit boards, structural electronics and antennas. In a sweeping discussion with Nano Dimension USA President Simon Fried, all my questions were answered about this innovative technology.

Copyright © 2018 I-Connect007. All rights reserved.