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Conductor Analysis Technologies announces the installation and operation of two OM Thermal Stress Systems at TTM’s Sterling, Virginia manufacturing facility.
Tim Estes, CAT Chief Technology Oﬃcer, and Nick Meeker, CAT Chief Operating Oﬃcer, were personally at the Sterling site to oversee the installation and provided training. The systems perform both convection reﬂow assembly simulation of the recently released IPC-TM-650, Method 2.7.27A and air-to-air thermal cycling of IPCTM-650, Method 22.214.171.124.
About Conductor Analysis Technologies, Inc.
Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by designers, purchasers, assemblers, and manufacturers of printed circuit boards. Founded in 1994, our products and services provide a standardized, independent, and documented evaluation of printed manufacturing capability, quality, and reliability. For more information, click here.
Gene Weiner, Weiner International Inc.
Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.
Patty Goldman, I-Connect007
The productronica show was indeed filled with new technology, and it was great to meet with people and learn about it. This is precisely how I met AGFA’s Frank Louwet, who filled me in on the Dipamat inkjet solder mask they have been developing. It seemed an odd choice to go from film to solder mask, but as Frank explained, it makes perfect sense.
Pete Starkey, I-Connect007
A return to the historic spa town of Harrogate in Yorkshire, England for the Institute of Circuit Technology Northern Seminar, to enjoy a diverse programme of presentations on safety standards, research in selective metal deposition, and developments in imaging and inspection techniques.